Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. weiterlesen
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. weiterlesen
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. weiterlesen
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. weiterlesen
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. weiterlesen
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. weiterlesen
Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application
The constant drive by designers to create more functionally unique products has challenged the assembly community for
some time. As a result,many processes have been developed under the “Necess
.. weiterlesen
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. weiterlesen
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. weiterlesen
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the
solder joint. The degree of wetting,the microstructure (in particular t
.. weiterlesen
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. weiterlesen
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. weiterlesen
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. weiterlesen
RoHS Substance Thresholds,Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
.. weiterlesen
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. weiterlesen
Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and re
.. weiterlesen
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. weiterlesen
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. weiterlesen
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. weiterlesen
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. weiterlesen
Chinese PCB Industry and the Association
The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion
USD production value in 2003. The association of the industry,CPCA,als
.. weiterlesen
Material Declarations: Risky Business - Perspectives from your Supply Base
Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance.
.. weiterlesen
Implementing a Successful Compliance Program for the EU's RoHS and WEEE Directives: Disclosure Levels,Roadblocks and Lessoned Learned
As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E
.. weiterlesen
Procedures for the Determination of Levels of Six Regulated Substances (Lead,Mercury,Cadmium,Hexavalent Chromium,Polybrominated Biphenyls,Polybrominated Biphenyl Ether) in Electrotechnical Products
The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg
.. weiterlesen
Building an Effective Hazardous Materials Compliance System: Managing RoHS,WEEE and Other Regulations
In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th
.. weiterlesen
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. weiterlesen
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. weiterlesen
IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. weiterlesen
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. weiterlesen
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. weiterlesen
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. weiterlesen
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. weiterlesen
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. weiterlesen
Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application
The constant drive by designers to create more functionally unique products has challenged the assembly community for
some time. As a result,many processes have been developed under the “Necess
.. weiterlesen
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. weiterlesen
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. weiterlesen
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the
solder joint. The degree of wetting,the microstructure (in particular t
.. weiterlesen
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. weiterlesen
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. weiterlesen
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. weiterlesen
RoHS Substance Thresholds,Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
.. weiterlesen
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. weiterlesen
Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and re
.. weiterlesen
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. weiterlesen
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. weiterlesen
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. weiterlesen
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. weiterlesen
Chinese PCB Industry and the Association
The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion
USD production value in 2003. The association of the industry,CPCA,als
.. weiterlesen
Material Declarations: Risky Business - Perspectives from your Supply Base
Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance.
.. weiterlesen
Implementing a Successful Compliance Program for the EU's RoHS and WEEE Directives: Disclosure Levels,Roadblocks and Lessoned Learned
As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E
.. weiterlesen
Procedures for the Determination of Levels of Six Regulated Substances (Lead,Mercury,Cadmium,Hexavalent Chromium,Polybrominated Biphenyls,Polybrominated Biphenyl Ether) in Electrotechnical Products
The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg
.. weiterlesen
Building an Effective Hazardous Materials Compliance System: Managing RoHS,WEEE and Other Regulations
In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th
.. weiterlesen
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. weiterlesen
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. weiterlesen