Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. weiterlesen
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. weiterlesen
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. weiterlesen
Salt Atmosphere,Temperature Humidity,Mechanical Shock Environmental Stress Testing Results,and FMA of the JG-PP / JCAA Lead Free Soldering Program
The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of
Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F
.. weiterlesen
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. weiterlesen
Flux Activator Disappearance on Two Circuit Board Substrates
The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and
glutaric acids. Three loadings of flux were applied to bare FR4 panels
.. weiterlesen
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. weiterlesen
Adhesiveless Copper on Polyimide Flexible Substrates and Interconnects for Medical Applications
Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good
representative circuits for medical applications. The polyimide die
.. weiterlesen
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. weiterlesen
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. weiterlesen
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. weiterlesen
Automating Tolerance to Process Variation
No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find
significant differences arising out of normal process variation – the componen
.. weiterlesen
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. weiterlesen
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. weiterlesen
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. weiterlesen
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. weiterlesen
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. weiterlesen
Peelable Solder Masks – New Formulations for Today’s Challenges
When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma
.. weiterlesen
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. weiterlesen
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. weiterlesen
The Flash Gold Surface Finish Technology
The advent of surface mount technology and now the lead free issue have ushered in a new wave of solderability treatments,
in particular the flat hard metal finishes. Among others these include
.. weiterlesen
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. weiterlesen
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. weiterlesen
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. weiterlesen
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. weiterlesen
First Article Inspection Strategies
In these days of high mix low volume there is increasing pressure on the SMT departments of manufacturing companies to
reduce changeover times and increase machinery utilization. An enormous ef
.. weiterlesen
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. weiterlesen
Concurrent Testing: Increasing Test Coverage without Affecting Cycle Time
Volume electronic manufacturing environments are constantly seeking solutions to bottlenecks at end-of-line test.
Bottlenecks are being seen increasingly on high volume automotive,telecomm & co
.. weiterlesen
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. weiterlesen
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. weiterlesen
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. weiterlesen
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. weiterlesen
Salt Atmosphere,Temperature Humidity,Mechanical Shock Environmental Stress Testing Results,and FMA of the JG-PP / JCAA Lead Free Soldering Program
The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of
Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F
.. weiterlesen
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. weiterlesen
Flux Activator Disappearance on Two Circuit Board Substrates
The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and
glutaric acids. Three loadings of flux were applied to bare FR4 panels
.. weiterlesen
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. weiterlesen
Adhesiveless Copper on Polyimide Flexible Substrates and Interconnects for Medical Applications
Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good
representative circuits for medical applications. The polyimide die
.. weiterlesen
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. weiterlesen
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. weiterlesen
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. weiterlesen
Automating Tolerance to Process Variation
No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find
significant differences arising out of normal process variation – the componen
.. weiterlesen
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. weiterlesen
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. weiterlesen
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. weiterlesen
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. weiterlesen
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. weiterlesen
Peelable Solder Masks – New Formulations for Today’s Challenges
When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma
.. weiterlesen
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. weiterlesen
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. weiterlesen
The Flash Gold Surface Finish Technology
The advent of surface mount technology and now the lead free issue have ushered in a new wave of solderability treatments,
in particular the flat hard metal finishes. Among others these include
.. weiterlesen
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. weiterlesen
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. weiterlesen
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. weiterlesen
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. weiterlesen
First Article Inspection Strategies
In these days of high mix low volume there is increasing pressure on the SMT departments of manufacturing companies to
reduce changeover times and increase machinery utilization. An enormous ef
.. weiterlesen
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. weiterlesen
Concurrent Testing: Increasing Test Coverage without Affecting Cycle Time
Volume electronic manufacturing environments are constantly seeking solutions to bottlenecks at end-of-line test.
Bottlenecks are being seen increasingly on high volume automotive,telecomm & co
.. weiterlesen
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. weiterlesen