Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. weiterlesen
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. weiterlesen
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. weiterlesen
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. weiterlesen
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. weiterlesen
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. weiterlesen
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. weiterlesen
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. weiterlesen
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. weiterlesen
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. weiterlesen
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. weiterlesen
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. weiterlesen
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. weiterlesen
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. weiterlesen
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. weiterlesen
Non-Telecom Optoelectronics
When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at
the turn of the millennium,and even after the bubble burst in 2001-2,tele
.. weiterlesen
Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
.. weiterlesen
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. weiterlesen
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. weiterlesen
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. weiterlesen
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. weiterlesen
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. weiterlesen
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. weiterlesen
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. weiterlesen
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. weiterlesen
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. weiterlesen
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. weiterlesen
Decoupling with Anodized Ta
Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k =
23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit
.. weiterlesen
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. weiterlesen
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. weiterlesen
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. weiterlesen
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. weiterlesen
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. weiterlesen
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. weiterlesen
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. weiterlesen
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. weiterlesen
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. weiterlesen
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. weiterlesen
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. weiterlesen
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. weiterlesen
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. weiterlesen
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. weiterlesen
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. weiterlesen
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. weiterlesen
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. weiterlesen
Non-Telecom Optoelectronics
When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at
the turn of the millennium,and even after the bubble burst in 2001-2,tele
.. weiterlesen
Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
.. weiterlesen
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. weiterlesen
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. weiterlesen
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. weiterlesen
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. weiterlesen
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. weiterlesen
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. weiterlesen
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. weiterlesen
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. weiterlesen
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. weiterlesen
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. weiterlesen
Decoupling with Anodized Ta
Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k =
23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit
.. weiterlesen
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. weiterlesen
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. weiterlesen