Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. weiterlesen
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. weiterlesen
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. weiterlesen
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. weiterlesen
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. weiterlesen
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. weiterlesen
CAD Toolsets: Today,Tomorrow and Over the Horizon
One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer
.. weiterlesen
PCB Design Using the Metric System
There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecisio
.. weiterlesen
The CAD Library of the Future
The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlo
.. weiterlesen
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. weiterlesen
Liquid Solders for High Temperature Solder Joints
This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder j
.. weiterlesen
Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process
During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japa
.. weiterlesen
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. weiterlesen
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. weiterlesen
Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping
Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a
simple and cost effective process. However,the material properties of
.. weiterlesen
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. weiterlesen
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. weiterlesen
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. weiterlesen
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. weiterlesen
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. weiterlesen
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. weiterlesen
Solder Preforms: Increasing Automated Placement Efficiency
Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon.
Preforms provide a highly repeatable volume of solder,with 100% metal conten
.. weiterlesen
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. weiterlesen
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. weiterlesen
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. weiterlesen
Optimal PCB Test Trace Design for Improved Quality Control
A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance
tolerances before any components are attached. A popular technique is to
.. weiterlesen
Effects of Conductor Surface Condition on High Frequency Loss
Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and
commercialization of more cost effective low loss laminate materials. These devel
.. weiterlesen
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. weiterlesen
High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns
The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials
are greatly impacting high speed interconnect designs. As the transf
.. weiterlesen
Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow
When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond
material costs.1 Impacts to the overall reflow process should be caref
.. weiterlesen
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. weiterlesen
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. weiterlesen
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. weiterlesen
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. weiterlesen
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. weiterlesen
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. weiterlesen
CAD Toolsets: Today,Tomorrow and Over the Horizon
One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer
.. weiterlesen
PCB Design Using the Metric System
There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecisio
.. weiterlesen
The CAD Library of the Future
The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlo
.. weiterlesen
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. weiterlesen
Liquid Solders for High Temperature Solder Joints
This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder j
.. weiterlesen
Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process
During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japa
.. weiterlesen
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. weiterlesen
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. weiterlesen
Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping
Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a
simple and cost effective process. However,the material properties of
.. weiterlesen
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. weiterlesen
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. weiterlesen
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. weiterlesen
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. weiterlesen
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. weiterlesen
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. weiterlesen
Solder Preforms: Increasing Automated Placement Efficiency
Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon.
Preforms provide a highly repeatable volume of solder,with 100% metal conten
.. weiterlesen
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. weiterlesen
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. weiterlesen
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. weiterlesen
Optimal PCB Test Trace Design for Improved Quality Control
A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance
tolerances before any components are attached. A popular technique is to
.. weiterlesen
Effects of Conductor Surface Condition on High Frequency Loss
Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and
commercialization of more cost effective low loss laminate materials. These devel
.. weiterlesen
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. weiterlesen
High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns
The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials
are greatly impacting high speed interconnect designs. As the transf
.. weiterlesen
Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow
When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond
material costs.1 Impacts to the overall reflow process should be caref
.. weiterlesen