Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. weiterlesen
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. weiterlesen
IPC 2610 - Documentation Package
With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count
increased,the number of files increased. As trace size and spacing began to decre
.. weiterlesen
Principles for Implementing BGA and CSP Technology
As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC
.. weiterlesen
Designing Resistors to Embed
Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly
emerging and pivotal technology for the PCB industry,perhaps preceded only
.. weiterlesen
PWB Design: Beyond Copper Interconnects
Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega
.. weiterlesen
Materials Information for Flex Designers and Fabricators
A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r
.. weiterlesen
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. weiterlesen
Flex Based 3D Package Innovations for Enabling Low Cost System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug
.. weiterlesen
Flexible Printed Boards
This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric
.. weiterlesen
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. weiterlesen
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. weiterlesen
Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based chara
.. weiterlesen
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. weiterlesen
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. weiterlesen
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. weiterlesen
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. weiterlesen
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. weiterlesen
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. weiterlesen
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. weiterlesen
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. weiterlesen
IPC 2610 - Documentation Package
With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count
increased,the number of files increased. As trace size and spacing began to decre
.. weiterlesen
Principles for Implementing BGA and CSP Technology
As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC
.. weiterlesen
Designing Resistors to Embed
Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly
emerging and pivotal technology for the PCB industry,perhaps preceded only
.. weiterlesen
PWB Design: Beyond Copper Interconnects
Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega
.. weiterlesen
Materials Information for Flex Designers and Fabricators
A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r
.. weiterlesen
Performance and Printing of Pb-Free Solder Paste for 100-micron Pitch Geometries
Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures
.. weiterlesen
Flex Based 3D Package Innovations for Enabling Low Cost System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug
.. weiterlesen
Flexible Printed Boards
This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric
.. weiterlesen
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. weiterlesen
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. weiterlesen
Optimized System Design Through Industry Benchmarking of Fabrication Tolerances and Material Properties
Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based chara
.. weiterlesen
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. weiterlesen
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. weiterlesen
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. weiterlesen
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. weiterlesen
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. weiterlesen
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. weiterlesen