Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. weiterlesen
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. weiterlesen
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. weiterlesen
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. weiterlesen
Selection of a Low VOC Conformal Coating
Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and
cabin management systems for the Boeing family of commercial airplanes. Boeing speci
.. weiterlesen
Silicone UV Conformal Coating
As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a
more attractive technology option over the incumbent thermal and moisture curing
.. weiterlesen
Solvent-Free Conformal Coatings – As Good as Conventional Types?
Conformal or protective coatings are widely used in
the electronics industry today and are available in a
large variety of different types and adjustments. The
"classic" or conventional conform
.. weiterlesen
Protecting Automotive Electronics with Vacuum-Deposited Parylene Increasing Electronic Longevity in the Global Automotive Industry
Over the years,electronic components have become
increasingly smaller and integrated. Spacing between
components and line to line spacing has continually
shrunk. This miniaturization has magnif
.. weiterlesen
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. weiterlesen
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. weiterlesen
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. weiterlesen
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. weiterlesen
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. weiterlesen
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. weiterlesen
Eliminating Wave Solder Waste with Automatic Dross Reclamation
Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks
to the Wave Soldering process is the high cost associated with maintaining and o
.. weiterlesen
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. weiterlesen
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. weiterlesen
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. weiterlesen
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. weiterlesen
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. weiterlesen
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. weiterlesen
Plastic Hermetic Packages for MEMS,MOEMS and Optoelectronic Devices?
The full hermetic package for electronics and
optoelectronic (OE) devices was first developed in
the 1800’s and has served these industries well. The
earliest optoelectronic devices,cathode ray
.. weiterlesen
Development of MEMS on Printed Wiring Board Platform
A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board
(PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) techno
.. weiterlesen
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. weiterlesen
MEMS-Based Microsystem Packaging
Sandia National Laboratories has programs covering
the range of MEMS technologies from LIGA to bulk
to surface micromachining. These MEMS
technologies are being considered for an equally
broad
.. weiterlesen
ESD – Steps Against Electrostatic Discharge – Prevention of Electronic Devices and Assemblies
Electronic devices become more and more smaller. Electronic assemblies are sensitive against electrostatic discharge
just as much as its smallest and most sensitive element. So protection syste
.. weiterlesen
State of the Art Detection and Analysis of Outgassed compounds for the Optoelectronics and Micro Assembly Industries
The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and
construct optoelectronic packages,sub-assemblies,and other electronic materials is b
.. weiterlesen
Optical Switch Packaging Wire-bonding and Encapsulation Approaches
The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over
extended distances in the optical domain,without the need for power-hungry and ba
.. weiterlesen
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. weiterlesen
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. weiterlesen
NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. weiterlesen
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. weiterlesen
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. weiterlesen
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. weiterlesen
Selection of a Low VOC Conformal Coating
Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and
cabin management systems for the Boeing family of commercial airplanes. Boeing speci
.. weiterlesen
Silicone UV Conformal Coating
As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a
more attractive technology option over the incumbent thermal and moisture curing
.. weiterlesen
Solvent-Free Conformal Coatings – As Good as Conventional Types?
Conformal or protective coatings are widely used in
the electronics industry today and are available in a
large variety of different types and adjustments. The
"classic" or conventional conform
.. weiterlesen
Protecting Automotive Electronics with Vacuum-Deposited Parylene Increasing Electronic Longevity in the Global Automotive Industry
Over the years,electronic components have become
increasingly smaller and integrated. Spacing between
components and line to line spacing has continually
shrunk. This miniaturization has magnif
.. weiterlesen
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. weiterlesen
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. weiterlesen
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. weiterlesen
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. weiterlesen
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. weiterlesen
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. weiterlesen
Eliminating Wave Solder Waste with Automatic Dross Reclamation
Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks
to the Wave Soldering process is the high cost associated with maintaining and o
.. weiterlesen
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. weiterlesen
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. weiterlesen
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. weiterlesen
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. weiterlesen
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. weiterlesen
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. weiterlesen
Plastic Hermetic Packages for MEMS,MOEMS and Optoelectronic Devices?
The full hermetic package for electronics and
optoelectronic (OE) devices was first developed in
the 1800’s and has served these industries well. The
earliest optoelectronic devices,cathode ray
.. weiterlesen
Development of MEMS on Printed Wiring Board Platform
A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board
(PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) techno
.. weiterlesen
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. weiterlesen
MEMS-Based Microsystem Packaging
Sandia National Laboratories has programs covering
the range of MEMS technologies from LIGA to bulk
to surface micromachining. These MEMS
technologies are being considered for an equally
broad
.. weiterlesen
ESD – Steps Against Electrostatic Discharge – Prevention of Electronic Devices and Assemblies
Electronic devices become more and more smaller. Electronic assemblies are sensitive against electrostatic discharge
just as much as its smallest and most sensitive element. So protection syste
.. weiterlesen
State of the Art Detection and Analysis of Outgassed compounds for the Optoelectronics and Micro Assembly Industries
The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and
construct optoelectronic packages,sub-assemblies,and other electronic materials is b
.. weiterlesen
Optical Switch Packaging Wire-bonding and Encapsulation Approaches
The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over
extended distances in the optical domain,without the need for power-hungry and ba
.. weiterlesen
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. weiterlesen
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. weiterlesen