Design high-speed PCBs that maintain signal integrity, reduce noise, and perform reliably under real operating conditions.

Design next-generation PCB systems that handle high-speed performance, advanced materials, and emerging manufacturing methods without compromising reliability.

Introduction to PCB Design I for electronics manufacturing

Design PCB layouts that meet performance requirements, pass validation, and move confidently into manufacturing.

Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.

To deepen industry engagement and expand global impact, the TPCA Show will collaborate with members of the Global Electronics Association (GEA) to promote sponsorship participation and technical outreach activities, including the organization of a Hand Soldering Competition. Conducted in alignment with IPC international standards, the competition will evaluate participants’ practical skills in soldering quality, process control, and workmanship compliance. Beyond showcasing technical excellence in electronics manufacturing, the event also reinforces industry awareness of quality and standardization while supporting workforce development and skills transfer. In parallel, the IMPACT Exhibition will focus on advanced packaging technologies, featuring dedicated symposium sessions jointly organized by the Taiwan Standards Committee and the Taiwan Technical Standards Committee. These sessions will highlight liquid cooling technologies for semiconductor and electronic packaging, covering industry trends, critical materials, reliability validation, and system integration. Through cross-disciplinary collaboration between standards bodies and industry experts, the initiative aims to build internationally aligned technical consensus and strengthen Taiwan’s competitive position in high-performance computing and next-generation electronic packaging.