This one-hour webinar presents an insight into the PCB Signal Integrity simulation and IBIS model characterization process. A review of what exactly signal integrity simulation does on the PCB and at the system level. A discussion on how the IBIS model is a default for analyzing IC Chips’ input/output waveform integrity. The IBIS model is broken down for easier understanding of its operation and integration into the SI simulation. In addition, a quick note on how to achieve accurate results for Signal Integrity simulation.

Design RF and high-speed boards that maintain signal integrity, meet tight tolerances, and perform reliably at high frequencies.

Design PCB systems that can withstand harsh operating conditions without sacrificing performance, reliability, or compliance.

Design high-density, complex PCB systems that meet performance requirements even as space, geometry, and packaging constraints increase.

Design PCB layouts that meet performance requirements, pass validation, and move confidently into manufacturing.

This demonstration line is jointly developed by the Global Electronics Association (GEA) together with Aurotek, Advantech AI, and Universal Robots, fully adopting the GEA/IPC CFX standard to enable plug-and-play connectivity, real-time data exchange, and end-to-end traceability. The line integrates AI-driven inspection and safety monitoring with collaborative robot automation, while seamlessly connecting to MES, ERP, and cloud platforms to create a highly connected smart manufacturing environment. Through this CFX showcase, the solution demonstrates a comprehensive digital management model spanning production, quality, and workforce safety—helping electronics manufacturers accelerate smart factory adoption, improve operational efficiency, and reduce overall risk.