Design PCB layouts that meet performance requirements, pass validation, and move confidently into manufacturing.

Taught by an industry expert with more than 40 years of experience in the field, this 3-week online program is designed to provide the knowledge and skills necessary to reduce or eliminate design, documentation, and capability issues that often arise when completed PCB designs are sent to the fabricator for production.

Join the 2026 Hand Soldering Competition - Regional Qualification Estonia for Students and Professionals, being held 14-16 October 2026 at TalTech University (Main Lobby) in Tallinn, Estonia. Competitors will demonstrate their soldering skills on a complex printed circuit board assembly within 60 minutes - for prizes, recognition, and the chance to secure a spot at the Hand Soldering World Championship. The student competition will take place on 14 October, followed by the professional competition on 15–16 October.

The 2026 Cable & Wire Harness Competition – Regional Qualification Estonia will take place on 15–16 October 2026 at TalTech University (Main Lobby) in Tallinn, Estonia. The competition invites skilled technicians and harness assembly specialists to demonstrate their expertise in wire preparation, crimping, splicing, and assembly — all under the requirements of IPC/WHMA-A-620, the industry standard for cable and wire harness assemblies. Participants will compete under timed conditions for 60 minutes using identical materials and tools, with results evaluated by certified IPC judges.

To deepen industry engagement and expand global impact, the TPCA Show will collaborate with members of the Global Electronics Association (GEA) to promote sponsorship participation and technical outreach activities, including the organization of a Hand Soldering Competition. Conducted in alignment with IPC international standards, the competition will evaluate participants’ practical skills in soldering quality, process control, and workmanship compliance. Beyond showcasing technical excellence in electronics manufacturing, the event also reinforces industry awareness of quality and standardization while supporting workforce development and skills transfer. In parallel, the IMPACT Exhibition will focus on advanced packaging technologies, featuring dedicated symposium sessions jointly organized by the Taiwan Standards Committee and the Taiwan Technical Standards Committee. These sessions will highlight liquid cooling technologies for semiconductor and electronic packaging, covering industry trends, critical materials, reliability validation, and system integration. Through cross-disciplinary collaboration between standards bodies and industry experts, the initiative aims to build internationally aligned technical consensus and strengthen Taiwan’s competitive position in high-performance computing and next-generation electronic packaging.

Introduction to Wire Harness Design II curriculum shifts the focus from "how to assemble and what is a connector" to "why and how to design".