Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
As more power is driven through active devices,the integrity of materials used to make the electrically conductive interfaces is becoming ever more critical to the performance of RF radar syste
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills
The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
The Study of the Nitrogen Effect for Wave Soldering Process
Recently,with significant increasing of solder manufacturing cost due to raw materials,electronics makers are also faced with the same difficulty. And they are finding solutions that save cost
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Step Stencil design when 01005 and 0.3mm pitch uBGA’s coexist with RF Shields
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally,there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
When Precision is not good enough
As PCB designs become ever more complex with more sequential build up layers,tighter annular ring designs and broader range of advanced materials,understanding the effect of material distortion
.. read more
Top Doing More With Less
A new technology for MLB pressing has been developed by MBT and industry partners,called TOP,Temperature Optimised Process. The goal was to reduce energy consumption and to improve product qual
.. read more
An Analytical Approach for the Design of Buried Capacitance PCBs
There are presently several techniques for forming a buried capacitor in the core of a multilayer board. For purposes of this discussion,attention will be directed toward a sheet capacitor; alt
.. read more
Embedded Passives Become Mainstream Technology,Finally!
Embedded passives,especially embedded resistors and capacitors have been a hot topic since the mid-to-late 1990s. It is easy to understand why they have generated so much interest. Technology c
.. read more
RoHS War Stories
The following article is a series of “from the trenches” stories,taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy. The accounts below p
.. read more
Laboratory 101: A Guide to Understanding your Testing Laboratory
Within today’s Consumer Electronics Industry,a laboratory report listing elemental content is standard protocol. Understanding the information listed within a lab report can be difficult and un
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. read more
Pockets of Contamination That Are Causing Field Failures and How to Avoid Them
The areas of entrapment on cleaned and no-clean assemblies are showing higher levels of contamination around BGA’s,in microvias and particularly under components like the QFN. Flux residues tra
.. read more
Virtual Access Technique Extends Test Coverage on PCB Assemblies
With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i
.. read more
RFS Handler Cone Chuck Simplification for Effective Handling Performance
In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured
.. read more
Flexible LED Arrays made by all screen printing Process
Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels
(LCD) and plasma display panels (PDP) have the lion’s share of the large
.. read more
Fine Line Thick Film Circuits with High Conductivity Built on Flexible Substrates are Capable of Soldering
Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat
.. read more
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
As more power is driven through active devices,the integrity of materials used to make the electrically conductive interfaces is becoming ever more critical to the performance of RF radar syste
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills
The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
The Study of the Nitrogen Effect for Wave Soldering Process
Recently,with significant increasing of solder manufacturing cost due to raw materials,electronics makers are also faced with the same difficulty. And they are finding solutions that save cost
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Step Stencil design when 01005 and 0.3mm pitch uBGA’s coexist with RF Shields
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally,there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
When Precision is not good enough
As PCB designs become ever more complex with more sequential build up layers,tighter annular ring designs and broader range of advanced materials,understanding the effect of material distortion
.. read more
Top Doing More With Less
A new technology for MLB pressing has been developed by MBT and industry partners,called TOP,Temperature Optimised Process. The goal was to reduce energy consumption and to improve product qual
.. read more
An Analytical Approach for the Design of Buried Capacitance PCBs
There are presently several techniques for forming a buried capacitor in the core of a multilayer board. For purposes of this discussion,attention will be directed toward a sheet capacitor; alt
.. read more
Embedded Passives Become Mainstream Technology,Finally!
Embedded passives,especially embedded resistors and capacitors have been a hot topic since the mid-to-late 1990s. It is easy to understand why they have generated so much interest. Technology c
.. read more
RoHS War Stories
The following article is a series of “from the trenches” stories,taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy. The accounts below p
.. read more
Laboratory 101: A Guide to Understanding your Testing Laboratory
Within today’s Consumer Electronics Industry,a laboratory report listing elemental content is standard protocol. Understanding the information listed within a lab report can be difficult and un
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. read more
Pockets of Contamination That Are Causing Field Failures and How to Avoid Them
The areas of entrapment on cleaned and no-clean assemblies are showing higher levels of contamination around BGA’s,in microvias and particularly under components like the QFN. Flux residues tra
.. read more
Virtual Access Technique Extends Test Coverage on PCB Assemblies
With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i
.. read more
RFS Handler Cone Chuck Simplification for Effective Handling Performance
In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured
.. read more
Flexible LED Arrays made by all screen printing Process
Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels
(LCD) and plasma display panels (PDP) have the lion’s share of the large
.. read more
Fine Line Thick Film Circuits with High Conductivity Built on Flexible Substrates are Capable of Soldering
Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat
.. read more
Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
.. read more