Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Analytical Model for an Inline Counter Flow Processor
The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
Predictor Model … Round Robin
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. read more
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. read more
Embedded Capacitor Material and Design Considerations for High Frequency Modules
In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded
capacit
.. read more
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Rising Opportunities for EMS Organizations In the Medical,Industrial,and Aerospace/Defense/Homeland Security Segments
As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e
.. read more
Changes in North American PWB Materials Infrastructure
This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
To be or not to be (before reflow): That is the question (in AOI)
Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p
.. read more
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. read more
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. read more
Tools & Methods for Lean Production Management in EA
Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre
.. read more
Development of Micro Drill Bit for Drilling Environment-Friendly PCBs
Currently environment-friendly PCBs (including lead-free assembly compatible PCB and halogen-free PCB) become popular in PCB industry to meet the requirements of environmental protection. Corre
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. read more
Calculating Total Cost of Ownership in Electronics Manufacturing
Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful
.. read more
Lean Kitting: A Case Study
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
An Analytical Model for an Inline Counter Flow Processor
The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
Predictor Model … Round Robin
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. read more
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. read more
Embedded Capacitor Material and Design Considerations for High Frequency Modules
In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded
capacit
.. read more
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Rising Opportunities for EMS Organizations In the Medical,Industrial,and Aerospace/Defense/Homeland Security Segments
As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e
.. read more
Changes in North American PWB Materials Infrastructure
This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
To be or not to be (before reflow): That is the question (in AOI)
Rarely do PCB manufacturers have the resources for purchasing an inspection machine for every stage of the manufacturing process. Typically,therefore,they have to decide whether to deploy AOI p
.. read more
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. read more
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. read more
Tools & Methods for Lean Production Management in EA
Lean manufacturing is far from a new concept,and many within the Electronics Assembly (EA) industry are already familiar with the principles and concepts behind it. However,in spite of widespre
.. read more
Development of Micro Drill Bit for Drilling Environment-Friendly PCBs
Currently environment-friendly PCBs (including lead-free assembly compatible PCB and halogen-free PCB) become popular in PCB industry to meet the requirements of environmental protection. Corre
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. read more
Calculating Total Cost of Ownership in Electronics Manufacturing
Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful
.. read more
Lean Kitting: A Case Study
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more