Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
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Cleanliness of Stencils and Cleaned Misprinted Circuit Boards
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see
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Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
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Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
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Zoom Fixtures for ATE
This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture
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Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component Rework/Repair
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
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NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
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Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch Components
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
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Counterfeit Electronics:Strategies for Fighting Counterfeit Electronics
•Background information
•Scope of the problem
–Anecdotal
–Study by International Chamber of Commerce
–Recent study US Dept of Commerce
•What to do about it ?
–“Findings” and “Best Practices”
•T
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Real or Fake? The Counterfeit Chip Conundrum
Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th
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Conformal Coatings for Tin Whisker Risk Management
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
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Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
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Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
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Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
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A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards
Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition
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Effective Transition of Electronics Production between Manufacturing Sites
“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the
automotive electronics industry. The result has been numerous plant closings an
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Migrating from Paper to Interactive Paperless Work Instructions
One of the effects of the ever increasing mountain of regulatory requirements and the globalization of markets is the need to
disseminate and collect information across the shop floor and the e
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Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
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Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
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Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
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Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
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Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
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Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
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Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
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Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
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