Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
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Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
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Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
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An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
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Solder Preforms: Increasing Automated Placement Efficiency
Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon.
Preforms provide a highly repeatable volume of solder,with 100% metal conten
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Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
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Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
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R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
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Optimal PCB Test Trace Design for Improved Quality Control
A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance
tolerances before any components are attached. A popular technique is to
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Effects of Conductor Surface Condition on High Frequency Loss
Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and
commercialization of more cost effective low loss laminate materials. These devel
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Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
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High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns
The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials
are greatly impacting high speed interconnect designs. As the transf
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Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow
When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond
material costs.1 Impacts to the overall reflow process should be caref
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Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
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Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures
Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits
(ICs). The primary purpose of encapsulating the SMT package using these
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Transitioning from a Reactive to a Proactive Manufacturing Culture
We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our
manufacturing operation or perhaps a competitor’s or supplier’s manufacturing ope
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Process Capability Studies – The Better Way
To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability
indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve
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The “Only Other” Sure Thing in Life
Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain:
death,taxes,and military business. As the overall North American
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Continuous Improvement: Know Thy Customer: Customer Relationship Management Pays
The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize
customer service. Customer Relationship Management (CRM),although a rela
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How to Take Care of Loyal Customers
Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to
buy products and services,buy a whole range of products and services from
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Lean and Continuous Improvement
Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and
methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Ka
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Three-dimensional Simulations of Current Density Distributions for Patterned Wafers and PCB's
Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve
the behaviour and performance of the plating reactors used for ele
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Enhancing the Performance of a Graphite Direct Metalization Process
Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is
especially the case in high technology and quick turn applications
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Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
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Process for Plugging Low to High Aspect Ratio Through-Holes with Polymer Thick Film Conductive Ink in Production Volumes
With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to
produce 100% fill is needed for the whole range of aspect ratios. With
.. read more