Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Virtual Access Technique Extends Test Coverage on PCB Assemblies
With greater time to market and time to volume pressures,manufacturers of populated printed circuit boards have traditionally relied upon un-powered vectorless testing to quickly and reliably i
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RFS Handler Cone Chuck Simplification for Effective Handling Performance
In today’s manufacturing world,higher equipment utilization and lower operating cost is the way forward. Newer machineries are usually well equipped to get the job done as they are manufactured
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Flexible LED Arrays made by all screen printing Process
Many flat panel display technologies were developed and commercialized since 1980s. Today,liquid crystal display panels
(LCD) and plasma display panels (PDP) have the lion’s share of the large
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Fine Line Thick Film Circuits with High Conductivity Built on Flexible Substrates are Capable of Soldering
Previously,the general understanding about polymer-base thick film flexible circuits consisted of low density with low electrical conductivity because of the organic matrix in the conductor mat
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Design for Low-Halogen Green Electronics
Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the
hottest topics for the upcoming years. Besides reduction of consu
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Liquid Photoresist and Soldermask Processing The Real Environmental Impact
Since the early days of PWBs,liquid photoresists and soldermasks have played indispensable roles in the manufacturing process. From the introduction of the original Kodak Photo Resist (KPR) and
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Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
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Root Cause of Corrosion on Aluminum Bond Pads
During the process from wafer fabrication to completing the final plastic package there are a number of upstream processes that negatively impact subsequent operations. Problems at wirebond can
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Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
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FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
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Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth
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Oscillating Nozzle Technology for Improved Cleaning Performance in Prewash Module
Implementation of lead-free soldering technology has created new interest in high performance cleaning of printed circuit assemblies (PCAs). Many studies have been commissioned regarding remova
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Cleaning Today’s Assemblies in Batch Systems
Batch cleaning of electronic assemblies is popular in all regions of the world and continues to grow due to its flexibility,ease-of-use and economic considerations. Batch spray-in-air processes
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ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture
All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post
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Solving Today’s Test Challenges: Razor Sharp Probes
Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability
Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w
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Section 41 Research & Experimentation Tax Credit
•Rewards businesses with a dollar for dollar reduction of tax
•Rewards “evolutionary” and “revolutionary” activities
•Federal tax benefit can be as high as 6.5% of investment in new products an
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Reducing Costs and Avoiding Risks in the Global Market
Companies seeking sales or suppliers in the global marketplace must proceed with caution. This presentation provides an overview of U.S. regulation of import and export transactions. Importers
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Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
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Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% volume increase,and in appearance turns from a bright shiny metallic m
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A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
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Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
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Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
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Fluid Flow Mechanics -Key to Low Standoff Cleaning
Over 3 years ago,Zestron initially addressed cleaning underneath 4 MIL standoff components. With the emergence of lead-free and even smaller components new challenges have now arisen to include
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Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
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Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
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