Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
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Successful Implementation of Insoluble Anodes in a Vertical Plating Acid Copper Tank at Electrotek Corporation in Oak Creek WI.
The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red
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Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
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Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
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Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive Losses
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
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Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
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Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
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Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
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REACH for Electronics Manufacturers
REACH presents a new set of direct and indirect risks for article manufacturers,including electronics manufacturers. Direct risks arise from obligations explicitly outlined in the REACH regulat
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Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
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An Analytical Model for an Inline Counter Flow Processor
The purpose of this paper is to demonstrate the value of mathematical modeling of PCB processes. This approach will identify the first order variables that control the process and the relative
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The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
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Predictor Model … Round Robin
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting this t-cycle lifetime is critical in optimizing product design
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A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
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1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
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How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
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Embedded Capacitor Material and Design Considerations for High Frequency Modules
In order to meet the never ending desire for smaller and cheaper electronics,many companies are pursuing the use of embedded passive technologies. There are several examples of embedded
capacit
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Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
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Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
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Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
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Rising Opportunities for EMS Organizations In the Medical,Industrial,and Aerospace/Defense/Homeland Security Segments
As electronics manufacturing,design and after market services evolve into as a strategic option for today’s electronics original equipment manufacturers (OEM),opportunities for further growth e
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Changes in North American PWB Materials Infrastructure
This paper will compare the current capabilities of raw material suppliers to the PWB industry to those same capabilities 10 and 20 years ago. Key raw materials such as resin,glass fabric,coppe
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Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
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Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
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The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
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