Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Environmental Compliance Documentation: What’s Next?
Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. read more
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. read more
A Comparison of Small Discretes and Polymer Thick Film Embedded Resistors for Mobile Phone Applications
As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save
board area. Two common solutions are the use of embedded passives and the use of
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Thin and Elastic Substrates for Ultrathin Multilayer Boards
New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting
resin system. They are composed of various lineups with the same r
.. read more
Novel Toughening Agents for Thermosetting Systems for PWB Base Materials
The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains
new slash sheets describing FR-4 base materials compatible with lead-free a
.. read more
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
Thermoplastic Electronic Packaging: Low Cost – High Versatility
Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including
MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
RoHS Substance Thresholds: Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium
(Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
.. read more
Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges
Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide
electronics industry. This paper reviews the status of Lead Free solde
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Physical Implementation of the High-Speed Design Process
Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints
defined by engineering and create a layout that adheres to those design
.. read more
Environmental Compliance Documentation: What’s Next?
Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. read more
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. read more
A Comparison of Small Discretes and Polymer Thick Film Embedded Resistors for Mobile Phone Applications
As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save
board area. Two common solutions are the use of embedded passives and the use of
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Thin and Elastic Substrates for Ultrathin Multilayer Boards
New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting
resin system. They are composed of various lineups with the same r
.. read more
Novel Toughening Agents for Thermosetting Systems for PWB Base Materials
The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains
new slash sheets describing FR-4 base materials compatible with lead-free a
.. read more
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
Thermoplastic Electronic Packaging: Low Cost – High Versatility
Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including
MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
RoHS Substance Thresholds: Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium
(Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
.. read more
Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges
Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide
electronics industry. This paper reviews the status of Lead Free solde
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Physical Implementation of the High-Speed Design Process
Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints
defined by engineering and create a layout that adheres to those design
.. read more