Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
Intellectual Property Management: Maximizing the Value of Your Copyright Trademark,Patent,and Trade Secret
Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w
.. read more
Transitioning to Offshore Sourcing Challenges
Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
The Effects of Tin Whisker Testing on Solder Connections
The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. read more
Precision Coating Deposition Techniques for Conformal Coating Applications
Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
The Ems Market for Tier II & III Providers
In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others.
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS
The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
Intellectual Property Management: Maximizing the Value of Your Copyright Trademark,Patent,and Trade Secret
Copyright,like all other forms of intellectual property,is based on negative rights. A copyright registrant may exclude others from reproducing a given copyrighted work,composing a derivative w
.. read more
Transitioning to Offshore Sourcing Challenges
Transitioning to offshore sourcing has become a seductive argument for cost reduction. Most managers agree that the impact has been beneficial to the consumer and the trading conglomerates. Thi
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
The Effects of Tin Whisker Testing on Solder Connections
The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. read more
Precision Coating Deposition Techniques for Conformal Coating Applications
Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
The Ems Market for Tier II & III Providers
In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others.
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS
The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more