Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns
The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials
are greatly impacting high speed interconnect designs. As the transf
.. read more
Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow
When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond
material costs.1 Impacts to the overall reflow process should be caref
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures
Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits
(ICs). The primary purpose of encapsulating the SMT package using these
.. read more
Transitioning from a Reactive to a Proactive Manufacturing Culture
We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our
manufacturing operation or perhaps a competitor’s or supplier’s manufacturing ope
.. read more
Process Capability Studies – The Better Way
To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability
indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve
.. read more
The “Only Other” Sure Thing in Life
Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain:
death,taxes,and military business. As the overall North American
.. read more
Continuous Improvement: Know Thy Customer: Customer Relationship Management Pays
The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize
customer service. Customer Relationship Management (CRM),although a rela
.. read more
How to Take Care of Loyal Customers
Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to
buy products and services,buy a whole range of products and services from
.. read more
Lean and Continuous Improvement
Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and
methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Ka
.. read more
Three-dimensional Simulations of Current Density Distributions for Patterned Wafers and PCB's
Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve
the behaviour and performance of the plating reactors used for ele
.. read more
Enhancing the Performance of a Graphite Direct Metalization Process
Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is
especially the case in high technology and quick turn applications
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Process for Plugging Low to High Aspect Ratio Through-Holes with Polymer Thick Film Conductive Ink in Production Volumes
With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to
produce 100% fill is needed for the whole range of aspect ratios. With
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process
The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability
high layer count multlayer interconnect devices is moving rapidly. PWB f
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Peroxy-Sulfuric Oxide Replacements – A Pathway to Improved Technology for Fine Line Processes
Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric
texturing processes. These lower cost processes,based on an orga
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more
Automatic Generation of RC Network Models for a BGA Package
The need for dynamic compact models for Integrated Circuits (ICs) is a well-recognized problem in electronics cooling
simulations of electronic systems. Simplified thermal models have been repo
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more
FPGA on Board
Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the
number of FPGA designs implemented. Not only have the number of desig
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns
The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials
are greatly impacting high speed interconnect designs. As the transf
.. read more
Power Consumption and Closed-loop Nitrogen Control Considerations in Lead-free Reflow
When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond
material costs.1 Impacts to the overall reflow process should be caref
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures
Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits
(ICs). The primary purpose of encapsulating the SMT package using these
.. read more
Transitioning from a Reactive to a Proactive Manufacturing Culture
We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our
manufacturing operation or perhaps a competitor’s or supplier’s manufacturing ope
.. read more
Process Capability Studies – The Better Way
To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability
indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve
.. read more
The “Only Other” Sure Thing in Life
Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain:
death,taxes,and military business. As the overall North American
.. read more
Continuous Improvement: Know Thy Customer: Customer Relationship Management Pays
The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize
customer service. Customer Relationship Management (CRM),although a rela
.. read more
How to Take Care of Loyal Customers
Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to
buy products and services,buy a whole range of products and services from
.. read more
Lean and Continuous Improvement
Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and
methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Ka
.. read more
Three-dimensional Simulations of Current Density Distributions for Patterned Wafers and PCB's
Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve
the behaviour and performance of the plating reactors used for ele
.. read more
Enhancing the Performance of a Graphite Direct Metalization Process
Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is
especially the case in high technology and quick turn applications
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Process for Plugging Low to High Aspect Ratio Through-Holes with Polymer Thick Film Conductive Ink in Production Volumes
With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to
produce 100% fill is needed for the whole range of aspect ratios. With
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process
The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability
high layer count multlayer interconnect devices is moving rapidly. PWB f
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Peroxy-Sulfuric Oxide Replacements – A Pathway to Improved Technology for Fine Line Processes
Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric
texturing processes. These lower cost processes,based on an orga
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more
Automatic Generation of RC Network Models for a BGA Package
The need for dynamic compact models for Integrated Circuits (ICs) is a well-recognized problem in electronics cooling
simulations of electronic systems. Simplified thermal models have been repo
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more
FPGA on Board
Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the
number of FPGA designs implemented. Not only have the number of desig
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more