Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
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Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
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Thermoplastic Electronic Packaging: Low Cost – High Versatility
Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including
MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik
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Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
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Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
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Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
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New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
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Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
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Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
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A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
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Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
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RoHS Substance Thresholds: Facts and Friction
Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium
(Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a
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Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges
Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide
electronics industry. This paper reviews the status of Lead Free solde
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Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
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Physical Implementation of the High-Speed Design Process
Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints
defined by engineering and create a layout that adheres to those design
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Equalized Metal Distribution Will Improve High-Speed PCB Performance
During the design phase of a project,distribution of metal on the external layers of printed circuit boards is not a
consideration. System designers concentrate on implementing the required log
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Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
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A Unique Process That Eliminates Solder Dross
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more
than half of the metal (solder) purchased for electronic manufacture
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New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
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Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
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Vacuum Soldering and Void-Free,Lead Free Solder Joints
Vacuum-condensation soldering is a new process,developed to combine the advantages of condensation soldering and
vacuum soldering. The lecture introduces the results of the project development,
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Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
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Running Lead Free Reflow Profiles Without Nitrogen
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are
considerably longer than those used for lead-bearing products. This is due to
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The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
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Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
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