Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Non-Telecom Optoelectronics
When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at
the turn of the millennium,and even after the bubble burst in 2001-2,tele
.. read more
Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
.. read more
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. read more
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. read more
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Non-Telecom Optoelectronics
When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at
the turn of the millennium,and even after the bubble burst in 2001-2,tele
.. read more
Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement
Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion
splicing,are reported. The focus of this paper is ultra low loss spli
.. read more
Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing
The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the
nascent fiber-optics industry. Under the auspices of the National Electro
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. read more
Drawing Note Generator
This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons
for the automation and some of the decisions that needed to be made be
.. read more
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more