Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Multilayer Board Thermal Robustness: Proposed New Test Method for Evaluating the Thermal Robustness of Multilayer Boards
Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process
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A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Investigating and Characterizing Reduced Whisker Growth from a Bright Pure Tin Process
The implementation of both RoHS and WEEE Directives by the European Union (EU) mandate that electrical and electronic
products put on the market within the EU shall contain restrictive amounts
.. read more
Tin Pest,A Review
With the transition to high tin solders,and 100% tin finishes,some concerns have been raised about the possible occurrence
of “Tin Pest”. This paper reviews the historical and recent data colle
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Effect of Voiding on Lead Free Reliability
This paper had as an aim to correlate the degree of voiding with reliability. Here the a purpose designed test vehicle was
used,in which seven different solder pastes from three manufacturers w
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Environmental Compliance Documentation: What’s Next?
Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces
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Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. read more
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
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A Comparison of Small Discretes and Polymer Thick Film Embedded Resistors for Mobile Phone Applications
As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save
board area. Two common solutions are the use of embedded passives and the use of
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
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Thin and Elastic Substrates for Ultrathin Multilayer Boards
New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting
resin system. They are composed of various lineups with the same r
.. read more
Novel Toughening Agents for Thermosetting Systems for PWB Base Materials
The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains
new slash sheets describing FR-4 base materials compatible with lead-free a
.. read more
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
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Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder paste printing or flux only attachment
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
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iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more