Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
A Cost Effective Solution for Supporting Populated Circuit Boards during the Solder Paste Print Operation
Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time
consuming to setup,and relatively expensive. This is because support pins or dedica
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Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation
The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products
mandate the enhancement of manufacturing systems and assembly yields. In fine pit
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Efficient Placement Performance Verification of Odd Form Assembly Equipment
One of the electronic assembly markets that has
been emerging in recent years is the automation
equipment associated with odd form component
placement and final product assembly. As with
insert
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Oven Characterization Using Machine Quality Management (MQM) Tools
Stability and repeatability are imperative in any
reflow oven today. If oven operation is not validated
periodically,all subsequent profiles and adjustments
are not reliable in finding or maint
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Multi-Stage Flux Filtration in Reflow Ovens
Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage
filtration systems offer many benefits,particularly in dealing with the byproduc
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The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead Processing
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
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Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
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Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
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High Phosphorus ENIG – Highest Resistance Against Corrosive Environment
Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a
final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a
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Recrystallization Principles Applied to Whisker Growth in Tin
Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus
whisker growth can be regarded as a grain growth phenomenon. In this paper we examine
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The 2002 - 2003 National Technology Roadmap for Electronic Interconnections
The OEM desires identified in the 2002 – 2003
roadmap clearly identify,through their emulators,the
present and future needs of the products that the
emulators represent. There are a total of ei
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Standization Effort in Japan in the Area of Optoelectronic Assembly Technology
We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in
collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEI
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The Impact of “High Speed Systems” on Electrical and Optical Interconnect
High speed systems operating at speeds of 2GHz and above are placing increasing demands on the
specifications of substrates and packaging of
components used within these systems. BPA has
review
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NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
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Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
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Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
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Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
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Selection of a Low VOC Conformal Coating
Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and
cabin management systems for the Boeing family of commercial airplanes. Boeing speci
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Silicone UV Conformal Coating
As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a
more attractive technology option over the incumbent thermal and moisture curing
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Solvent-Free Conformal Coatings – As Good as Conventional Types?
Conformal or protective coatings are widely used in
the electronics industry today and are available in a
large variety of different types and adjustments. The
"classic" or conventional conform
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Protecting Automotive Electronics with Vacuum-Deposited Parylene Increasing Electronic Longevity in the Global Automotive Industry
Over the years,electronic components have become
increasingly smaller and integrated. Spacing between
components and line to line spacing has continually
shrunk. This miniaturization has magnif
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Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
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Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
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Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
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SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
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