Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
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Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
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Eliminating Wave Solder Waste with Automatic Dross Reclamation
Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks
to the Wave Soldering process is the high cost associated with maintaining and o
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Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
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Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
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Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
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Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
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Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Plastic Hermetic Packages for MEMS,MOEMS and Optoelectronic Devices?
The full hermetic package for electronics and
optoelectronic (OE) devices was first developed in
the 1800’s and has served these industries well. The
earliest optoelectronic devices,cathode ray
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Development of MEMS on Printed Wiring Board Platform
A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board
(PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) techno
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Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
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MEMS-Based Microsystem Packaging
Sandia National Laboratories has programs covering
the range of MEMS technologies from LIGA to bulk
to surface micromachining. These MEMS
technologies are being considered for an equally
broad
.. read more
ESD – Steps Against Electrostatic Discharge – Prevention of Electronic Devices and Assemblies
Electronic devices become more and more smaller. Electronic assemblies are sensitive against electrostatic discharge
just as much as its smallest and most sensitive element. So protection syste
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State of the Art Detection and Analysis of Outgassed compounds for the Optoelectronics and Micro Assembly Industries
The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and
construct optoelectronic packages,sub-assemblies,and other electronic materials is b
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Optical Switch Packaging Wire-bonding and Encapsulation Approaches
The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over
extended distances in the optical domain,without the need for power-hungry and ba
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Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
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Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
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A Technique for Improving the Yields of Fine Feature Prints
A technique that enhances the release of solder paste from stencils during the print process has been developed. The
technique is based on applying variable high frequency and low amplitude vib
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The Bumping of Wafer Level Packages
The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller,
efficient electronic packages. In recent years wafer level packaging concepts ha
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Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
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Optimizing the Supply Chain with Returnable Packaging: Solutions to Improve Profitability in the Electronics Industry
In the complex electronics industry,supply chain costs can have a major impact on a company’s profitability. Like
the industrial supply chain,where costs are estimated to account for as much as
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Stencil Printing Studies
Today’s SMT assemblies are being driven toward SMD’s with higher lead densities as well as smaller packages.
This places additional performance requirements on the printing process. The stencil
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Defining Solder Paste Performance via Novel Quantitative Methods
Quantitative solder paste performance or use testing enables material formulators to focus on and maximize key
material traits such as wettability and printability. These same material test met
.. read more
Print Process Characterization for Fine Pitch Area Array Packages using Taguchi Techniques
The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area
array packages instead of fine pitch leaded packages. These area array packages
.. read more