IPC Hand Soldering Competition Returns to What’s New in Electronics Live 2018

IPC’s Hand Soldering Competition returns to the United Kingdom and What’s New in Electronics Live on September 25-26, 2018. This year, the competition will be run in association with Advanced Rework Technology Ltd.

Skilled competitors will go soldering iron to soldering iron as they vie for cash prizes:  1st place — £200, plus a trip to the World Hand Soldering Championship at IPC APEX EXPO 2019; 2nd place — £100; 3rd place — £50, and bragging rights as the best hand soldering technician in the United Kingdom.

Hand soldering of high density printed boards demands highly skilled operators to ensure a zero-defect soldering process, and this competition recognizes the best skills in hand soldering complex printed board assemblies. Over two days, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610G Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructor Debbie Wade from Advanced Rework Technology Ltd. Will serve as the judge.

“Many companies take pride in how many IPC Certified Specialists they have on staff and this event is a fun and friendly way to give them an opportunity to let their staff shine,” said David Bergman, IPC vice president of standards and training.

What’s New in Electronics Live 2018 would like to thank the sponsors of the hand soldering competition: Pace Worldwide, Henkel, PM Tech, Somerset Solders and Bofa.

Event attendees who are interested, can stop by booth F66 in Hall 1 at the NEC Birmingham to see the competition or visit with IPC staff to learn about IPC standards, membership and other IPC products.   

IPC Renews Concern Over Third Round of U.S. Tariffs on Chinese Imports

John Mitchell, IPC president and CEO, issued the following statement on the decision of the U.S. government to impose additional tariffs on about $200 billion worth of Chinese imports, the third such list announced this year. 

“IPC backs robust efforts by the United States to address discriminatory treatment of U.S. companies by its trading partners. We hold this same position in each of the countries where we have member companies. Trade agreements are meaningful only so long as countries that voluntarily enter into them live up to the obligations they have made.

The United States has longstanding concerns about China’s technology transfer policies. The decision yesterday by President Trump to impose the most far-reaching tariffs yet on Chinese imports will further disrupt the international supply chains of many U.S. electronics companies. These disruptions will increase lead times, raise the cost of production and, in some cases, undermine the global competitiveness of U.S. manufacturing. 

IPC urges the U.S. Trade Representative to intensify efforts to resolve the trade dispute with China through bilateral negotiations and multilateral remedies. We also encourage the U.S. Government to continue its efforts to strengthen the electronics industrial base through a combination of tax, workforce, defense, and R&D policies. Such initiatives are the best way to revitalize the U.S. Electronics supply chain for the long-term.”

IPC and i4.0 Today to Host i4.0 Connect Forum

Sixty-six percent of manufacturing companies say that their leadership does not have a clear vision for the digital future. As manufacturing moves toward the Smart Factory and Industry 4.0, IPC and i4.0 Today will offer members of the electronics industry an opportunity to learn about the technology and future surrounding Industry 4.0 with a two-day i4.0 Connect Forum, to take place in Silicon Valley, Calif., November 6-7.

"According to statistics, the Industry 4.0 market is projected to reach $152 billion by 2020,” said David Bergman, IPC vice president of standards and training. “Augmented reality, artificial intelligence, robotics, additive manufacturing, and IPC CFX are just a few of the technologies taking us toward Industry 4.0 and the Smart Factory. What does this mean for the electronics industry? What are the benefits and how does it all come together? The i4.0 Connect Forum will address these questions and provide first-hand knowledge from industry leaders who are working to achieve smart manufacturing practices."

Featuring speakers from Siemens, Saline Lectronics, and Koh Young Technology, the i4.0 Connect Forum will provide attendees with first-hand knowledge of the experiences, challenges and solutions industry leaders are taking to achieve truly smart manufacturing. “In a time of rapid and fundamental growth in the manufacturing industry, this Forum will provide insight into how robotics, artificial intelligence and other technologies are creating an Industry 4.0 movement in electronics manufacturing,” added Bergman.

“This event will give attendees an opportunity to listen, learn and contribute towards achieving Industry 4.0 standards, and gain knowledge directly from the experts who will be there to share their experiences. This is a must attend event to help keep you at the forefront of Industry 4.0 in electronics” added Mike Nelson, Group President for i4.0 Today.

For more information on i4.0 Connect Forum or to register, visit www.ipc.org/i4.0-Connect.

IPC Offers Certification for Electronics Program Management

In direct response to requests from industry to provide training and certification in various aspects of the electronics industry, IPC is introducing its newest certification course, the IPC Certified Electronics Program Manager (CEPM) Training and Certification. CEPM is a six-week, online, instructor-led course providing all aspects of program management specific to the electronics industry. 

“We’re excited to offer our CEPM course through the e-learning platform IPC EDGE 2.0,” said Dave Hernandez, senior director of learning and professional development. “This course is ideal for existing program managers or engineers who want to advance their expertise and skills in the electronics industry. Because the course is offered online, it offers significant cost savings and flexibility for companies seeking to provide professional development to their top talent.”

The first course will start on October 8, 2018 with two sessions each week for a total of six weeks. The CEPM course will cover:

  • Program management
  • Project planning
  • Team building
  • Basic cost accounting practices
  • Forecasting and inventory control
  • Negotiating contractual terms with customers
  • Sales and negotiation skills

IPC’s CEPM course is part of IPC EDGE 2.0 which offers education through online courses, webinars, videos, white papers, personal development, technical knowledge and technical presentations. IPC EDGE 2.0 is convenient and easily accessible, allowing students to learn at their own pace, with knowledge checks within each course to determine next steps.

For more information on the IPC Certified Electronics Program Manager (CEPM) Training and Certification Program, visit https://training.ipc.org/product/certified-electronics-program-manager-cepm-program.

New IPC Report Assesses Growth Potential in North American EMS Industry

2018 Annual Report and Forecast for the North American EMS Industry Released

The North American electronics manufacturing services (EMS) industry has an $81 billion served available market with great potential for further growth, according to IPC’s 2018 Annual Report and Forecast for the North American EMS Industry, published this week. An analysis of the market indicates that the North American EMS industry has penetrated only about 28 percent of the total available market based on what OEMs in the region could outsource. Forecasts contributed by New Venture Research predict steady growth for the EMS industry through 2022, both globally and in North America.

The rate of sales growth for the participants in IPC’s North American EMS Statistical Program has increased every year since 2014, reaching 10.5 percent year-over-year in 2017. EMS order backlogs as percentages of sales have also grown steadily over the past five years. The largest vertical market for the program participants in 2017 was industrial electronics, which captured 37 percent of their aggregate sales. Revenue by product type, percentages of domestic production, number of EMS facilities and historical growth trends are also reported.

The report also covers aggregate financial and operational measurements of the participating companies in 2017 by company size tier. The smallest companies reported the highest profit margins, EBITDA and return on value added. An overview of the cost structure of North American EMS companies by size tier delves into percentages of direct labor; direct materials; direct overhead; and sales, general and administrative costs. Other measurements reported include revenue per employee, cash-to-cash cycle time, days sales outstanding, days of supply in inventory and capacity utilization.

The data on sales, orders, production, operations and financial measurements is from 86 companies that participated in IPC’s North American EMS Statistical Program in 2017, most of which are small and medium-sized companies.

The 2018 Annual Report and Forecast for the North American EMS Industry, (at $450 for IPC members and $900 for nonmembers, is available for download in IPC’s online store. For information on IPC market research reports and services, visit www.ipc.org/market-research-reports and www.ipc.org/IndustryData, or contact IPC’s market research team at marketresearch@ipc.org.

IPC Issues Call for Participation for Third Annual IPC High Reliability Forum

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.

IPC High Reliability Forum provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives across the electronics industry supply chain. Staff from companies such as NASA Goddard Space Flight Center, Honeywell Aerospace, Lockheed Martin Missiles and Fire Control, Motorola and Raytheon have presented papers at past IPC High Reliability Forums.

With a focus on electronics subjected to harsh use environments, expert papers and presentations are being sought on the following topics:

  • Mechanical stress reliability - vibration and shock Methods (software) for predicting reliability
  • Failure Modes Effects Analysis (FMEA)
  • Thermal Mitigation
  • Thermal Stress Test Methods

 
  • HDI Reliability
  • Microvia Failures and Testing Methods
  • Microvia Reliability
  • Design for Reliability
  • Design Rules for Spacing and Staggered Vias

 
  • Failures Related to Laminate Materials
  • Materials Compatibility
  • System-level effects on Solder Joint Reliability
  • Assembly Tests for Solder Joint Reliability

Abstracts summarizing original and previously unpublished work must be submitted for consideration to present. Presentations should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Final presentations should be 45 minutes in length, including time for questions and answers.

To submit an abstract, contact Alicia Balonek, IPC senior director of trade shows and events, at AliciaBalonek@ipc.org.  

North American PCB Industry Growth Continues

IPC Releases PCB Industry Results for July 2018

IPC announced today the July 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for July held steady at 1.05.

Total North American PCB shipments in July 2018 were up 10.8 percent compared to the same month last year. This year to date, shipments are 10.5 percent above the same period last year. Compared to the preceding month, July shipments decreased 19.1 percent.

PCB bookings in July increased 4.9 percent year-over-year. Year-to-date order growth was 11.7 percent above the same period last year. Bookings in July were down 12.3 percent from the previous month.

“Business growth continued in July for the North American PCB industry although at a slightly slower pace than in the previous month,” said Sharon Starr, IPC’s director of market research. “July was the 11th consecutive month of sales growth and the 14th month of continuous order growth. The month-to-month decreases in sales and orders in July follows a typical seasonal pattern in which business is strongest in the last month of the quarter and falls off in the first month of the next quarter, probably due to sales activity. The book-to-bill ratio in July remained above parity (1.0) for the 18th consecutive month, which is a positive indicator of continued growth for the remainder of this year.”


Note: The January 2018-March 2018 ratios have been revised since their original publication due to updated data from statistical program participants.


Note: The June 2017 and January 2018-March 2018 growth rates have been revised since their original publication due to updated data from statistical program participants.

View Chart in PDF

Detailed Data Available

The next edition of IPC’s North American PCB Market Report,containing detailed third-quarter 2018 data from IPC’s PCB Statistical Program, will be available in November. The quarterly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. PCB companies that are IPC members doing business in North America are invited to contact marketresearch@ipc.org for information about participating. More information about this report can be found at www.ipc.org/market-research-reports.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

IPC and SMTA to Present High-Reliability Cleaning and Conformal Coating Conference

Event will cover technological developments in all areas of cleaning and conformal coating

IPC in partnership with Surface Mount Technology Association (SMTA) will host the High-Reliability Cleaning and Conformal Coating Conference, November 13–15, at the Chicago Marriott in Schaumburg, Ill. The 2018 conference will focus on electronics assembly and the influence of cleanliness and coating on producing reliable hardware.

Prior to the technical conference, a full-day of classroom tutorials will be held on November 13 and will introduce attendees to basic/intermediate-level instruction. In the morning, Doug Pauls, Rockwell Collins, will present “IPC-J-STD-001G Am1-Cleaniness Requirements.” In the afternoon session, instructor Jason Keeping, Celestica, will present “Conformal Coating Best Practices.”

The technical conference begins on November 14 with opening remarks from Program Chair Dr. Mike Bixenman, KYZEN Corporation. Conference sessions on day one include: cleanliness considerations for building reliable hardware, jet printing cleaning challenges, adapting coating applications for high density electronics and improving reliability of circuit assemblies in harsh environments.

Conference sessions on day two will cover ultra-thin conformal coatings advancements, cleaning/coating test methods and process considerations links between design manufacturing, methods for conformal coating masking and engineering performance, compatibility and environmental conformance of cleaning agents.

“Today, how to address the issue of ‘how clean is clean’ is quite a challenge, as conductors and circuit traces have become increasingly narrower. What is acceptably clean for one industry segment may be unacceptable in others” said conference program chairman Dr. Mike Bixenman, CTO and founder of KYZEN Corporation. “This comprehensive event includes technical sessions, tutorials, tabletop exhibits and networking activities. It will cover technological developments in all areas of cleaning and coating with an emphasis on real-world problems and solutions.”

For complete event agenda and registration information, visit http://www.ipc.org/2018-IPC-SMTA.

IPC APEX EXPO 2019 Opening Keynote Speaker JB Straubel to Highlight Tesla’s Success in Disrupting and Accelerating Innovation

Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2019 will feature JB Straubel, chief technical officer (CTO) and co-founder of electric vehicle maker Tesla, Inc. Straubel will present “Accelerating and Disrupting Innovation: The Tesla Story” on Tuesday, January 29, 2019.

At Tesla, Straubel focuses on technical direction and engineering design including battery technology, power electronics, motors, software, firmware and controls. He also launched many Tesla initiatives including: the Tesla Energy business providing grid storage for commercial utilities and residential consumers; the worldwide Tesla Supercharger network of fast DC chargers; and the Tesla Gigafactory which is leading the way toward increasing worldwide battery production and lowering the cost per kWh. He also has responsibility for new technology evaluation, R&D and technical diligence review of key vendors.

Straubel has had a lifelong interest in electric vehicles, including rebuilding an electric golf cart at the age of 14, building an Electric Porsche 944 that held a world EV racing record, solar car racing and building a hybrid trailer system that he designed while in college. In 2008 the MIT Technology Review chose Straubel as “#1 Innovator of 35 under 35 for the year.” In 2009, DesignNews named him “Engineer of the Year,” and in 2015 he was listed as #2 on Fortune’s 40 under 40 most influential business and innovation leaders.   In addition, Straubel is an inventor on more than 30 patents covering most areas of Tesla’s core battery, motor and controls systems. He received a BS in Energy Systems Engineering and an MS in Energy Engineering, emphasis on energy conversion, both from Stanford University. Outside of Tesla Motors, Straubel is also an active cyclist and pilot and holds private pilot, instrument, glider and multi-engine ratings.

Breaking through barriers to innovate faster and better has been Straubel’s strength.

In his presentation, Straubel will draw on his extensive experience and share the history of Tesla, detailing that innovation wasn’t an add-on to its operations but woven into every element of the business. He will also answer the perennial question, “How can my organization re-engineer itself to create products and ideas that answer 21st century needs?

Straubel’s opening keynote is free to all registered IPC APEX EXPO attendees. The conference and exhibition will run January 29–31, 2019. For more information, visit www.IPCAPEXEXPO.org.

IPC E-Textiles Committee Releases White Paper on Washability of E-Textiles

IPC’s D-70 E-Textiles Committee has released IPC WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market. This white paper provides insights from a team of researchers on e-textiles washability testing parameters and initial results from those tests. The D-70 committee plans for IPC-WP-024 to be the first in a series of papers from industry.

Current research in smart textiles and e-textiles indicates that they are not yet ready for the market at a large scale due to problems that exist with reliability and the difficulty with laundering e-textile structures. Specific to reliability, e-textile structures should be in good functioning condition over a period of several years, if used in accordance with product guidelines. However, the additional issues of integration, connector elements, and overall supply chain integration are critical for success. IPC-WP-024 emphasizes all the problems inherent in creating effective e-textiles, encompassing efforts that industry and research laboratories must undertake to make e-textile structures more robust.

The D-70 committee invites readers to also provide white papers with their own findings and perspectives on e-textiles washability reliability. To propose a white paper topic, email etextiles@ipc.org.

Chair of the IPC D-70 Committee, Stephanie Rodgers of Apex Mills says, “Home laundering and commercial cleaning is an everyday reality for millions of textile wearable products. Explosive growth in e-textiles is just starting to break through performance market segments making standardization urgently necessary. This e-textile laundering research identifies with the procedure and requirements gap of these merging manufacturing technologies. The IPC E-Textiles Committee is corralling industry manufacturers to participate in the discussion of new e-textiles standards creation.”

IPC-WP-024 will be provided free of charge to all IPC E-Textiles 2018 attendees. The D-70 committee plans to discuss how standards should address washability reliability during the standards committee forum, which will take place September 12, 2018, the day before E-Textiles 2018. To register for IPC E-Textiles 2018, visit www.ipc.org/E-Textiles-2018.

For more information or to purchase WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market, visit http://shop.ipc.org/IPC-WP-024-English-D.

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