M-EXPO Wire Processing Technology 2019 Exhibit Space Sold Out; Wait List Open

Exhibitor booth space at the third annual M-EXPO Wire Processing Technology 2019 in Ciudad Juárez, México, is sold out and wait-list applications are being accepted.

M-EXPO 2019 has more than doubled its event space from 2018 and has exceeded expectations by selling out the exhibit space a month before the event. This year’s event is being held on October 9-11, 2019 at the Cuatro Siglos Convention Center, co-locating with the ninth annual EXPO-MRO.

Featuring  nearly 50 exhibitors showcasing the latest equipment, tools, materials and technologies within the wire and cable industry, exhibitors include Komax, Schleuniger, Cirris, HellermannTyton, HST, Identco, Immsa, Lakes Precision, Lone Star, Schaefer Megomat, IPC/WHMA, Wiring Harness News, BiTech, Cami, Curti, Schunck, Ricardo & Barbosa, and many more. Check the M-EXPO website for the full exhibitor list.

In addition to the sold-out exhibit space, the show sponsored by IPC/WHMA, includes an exciting lineup of conferences and training sessions:

Wednesday, October 9, 2019
12:00 pm  What is IPC/WHMA? What Can IPC/WHMA Do for You?
Presented by IPC/WHMA
3:30 pm Managing the Risks of your Supply Chain
Presented by APICS
5:00 pm Crimping Beyond the Basics
Presented by Crimping & Stamping Technologies
Thursday, October 10, 2019
12:00 pm  IPC/WHMA-A-620 Emerging Needs for Criteria – Repair/Rework, Design for Manufacturing (DFM) Issues, High Voltage Electric Mobility
Presented by IPC/WHMA
3:30 pm Arcadia Wire Harness Software
Presented by Cadonix
Friday, October 11, 2019
3:30 pm  Ultrasonic Welding
Presented by Schunk Sonosystems

Presentations are open to everyone at no additional cost. Since seating is limited, advance registration is advised. For more information on M-EXPO or to register, visit www.mexpowire.com.

For companies interested in being added to M-EXPO exhibitor wait list , contact Ricardo Aguirre at 915-304-4291 or contact.us@mexpowire.com.

IPC Designs for Excellence in Conjunction with PCB Carolina

Speaker Dale Lee, Plexus, to lead day-long instruction on DFX

IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.

Providing a comprehensive review of pitfalls that can occur in assembly and how they often have a direct link to design, the seminar will be led by instructor Dale Lee, senior staff DFX strategy engineer, Plexus Corporation.

Geared toward designers, manufacturing/process engineers, quality and reliability engineers, and managers or technicians involved in the design, fabrication, assembly or testing of printed board assemblies, attendees will learn:

  • The effect of bare board choices on function and reliability of assembly
  • How PCB design complexity impacts on fabrication costs and reliability
  • Limitations of industry standards
  • PCB design effects on assembly: thermal balance, trace routing, via interconnection, Z-axis TCE
  • Impacts of component and PCB warpage/flatness on yields and reliability
  • Impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage

 “There is a direct connection between the design of a device and complications that may occur in the assembly process,” said Brook Sandy-Smith, IPC technical conference program manager. “This course will shine a light on those opportunities for improvement, taught by a distinguished expert in the field.”

For more information on Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) or to register, visit www.ipc.org/DfX-workshop.

Emerging Technologies Take Center Stage at IPC Electronics Materials Forum

New IPC technical conference features keynote by autonomous auto expert Lenora Clark

The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. Will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.

Geared toward engineers and managers that procure materials or seek an understanding of advancements in materials for the board, assembly, components and protective layers, the IPC Electronics Materials Forum will emphasize the emerging technologies that challenge the existing materials set. Interactive panels and networking opportunities will provide attendees an open forum to discuss solutions to challenges.

The Forum will feature a keynote by Lenora Clark, director, autonomous driving and safety technology for MacDermid Alpha Automotive, who will present insights into all aspects of electronics, uniting circuitry, semiconductor and assembly solutions to support future automotive market needs.

“You can envision many future technologies, but you cannot create them without materials and processes to manufacture them,” said Brook Sandy-Smith, technical conference program manager. “Emerging technologies that challenge our existing materials set will inform the developments needed for the future, and we have an impressive lineup of speakers, including Lenora Clark as our keynote, at IPC Electronics Materials Forum to lead the way.”

More than 20 companies will be represented at the Forum, including Continental Automotive Systems, Averatak, Calumet Electronics, Indium, Lockheed Martin and Raytheon, among others.

Topics to be presented include:

  • Semi-additive processes for high density interconnect
  • Additive textile manufacturing for electrical connections
  • SIR test method for underfill reliability in automotive electronics
  • Digitization of organic electronics information: Materials, manufacturing and devices
  • Reliable and cost-effective nickel-free solutions for high-frequency/high-density applications
  • Evaluation of PCB through hole plating, drill, and desmear quality for new laminate materials
  • Trends and developments in electronic protection materials

For more information about the IPC Electronics Materials Forum or to register, visit www.ipc.org/Materials-Forum-2019.

B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference

Award-winning engineer, space explorer, and novelist to share highlights of his career

B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL) and successful science fiction writer, will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.

Responsible for the engineering integrity of all robotic planetary missions managed by JPL for NASA, Lee provided engineering oversight for the Curiosity rover mission to Mars in 2012, the Dawn mission to the asteroids Vesta and Ceres, the Juno mission to Jupiter and the GRAIL missions to the Moon. Previously, Lee provided oversight and guidance for the engineering aspects of the Phoenix and twin rover missions to Mars, as well as NASA’s successful Deep Impact and Stardust missions.

Recipient of the Medal for Exceptional Scientific Achievement and their Distinguished Service Medal from NASA, Lee received the Harold Masursky Award from the American Astronomical Society, the Al Seiff Memorial Award from the International Planetary Probe Workshop, and the Simon Ramo Medal by the IEEE for “career excellence in engineering.”

“Not only has Mr. Lee’s made outstanding contributions to solar system exploration, but his work as a science fiction novelist, futurist, computer product designer and lecturer have significantly enhanced science literacy,” said David Bergman, WHMA executive director. “We are thrilled to welcome him to WHMA and we look forward to his keynote speech. With the recent discovery of thousands of planets orbiting around other stars, it allows keynote participants to truly question, are we alone in the universe?”   

For more information on conference including schedule, speaker profiles or to register for event, visit http://annualconference.whma.org.

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA/MLF Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal Integrity
  • Industry 4.0
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, November 15, 2019, to https://ipcapexexpo2020.ipc.org/secure/CFPosters.aspx.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org. Or Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org

IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community

IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.

Presentation highlights of the technical conference agenda include:

  • Design and Fabrication Techniques of Textile-Based Embroidered RFID Tags for Apparels
  • Reliability and Washability of Textile-Based Circuit Boards
  • Warp Knitted Solutions for E-Textile Applications
  • Conductive Patterns on Textiles by Laser Welding
  • Printed Electronics – Electrifying Textiles for Smart Applications
  • The New Drug Delivery frontier – Textiles
  • Wearable Sensors for Your Favorite Sports
  • E-Textiles as an Enabling Technology to Create More Discreet and Desirable Assistive Technology for Older Adults
  • Advanced Inkjet Printed E-Textiles for Health Monitoring in Military Applications
  • Design in Confidence in E-Textiles

“Smart textiles, encompassing electronics combined with textiles (e-textiles) have a very promising realm in science and technology,” said Vladan Koncar, ENSAIT, GEMTEXT, University of Lille and IPC E-Textiles Committee Europe chair. “Numerous materials, systems and devices are available for e-textiles applications, but there are challenges to making these materials, systems and devices compatible as a full e-textiles product. As a conference where scientists and people from the industry can meet and exchange experiences and knowledge, IPC E-Textiles 2019 is, therefore, tremendous.”

Unique to any other e-textiles event in Europe, IPC E-Textiles Europe 2019 will also include an IPC E-Textiles Committee in Europe meeting, where participants will be able to collaborate on IPC international standards for e-textiles.

For questions about the conference or joining the IPC E-Textiles Committee in Europe meeting or any other IPC international e-textiles standards activities, contact Chris Jorgensen, director, technology transfer, at ChrisJorgensen@ipc.org or visit www.ipc.org/E-Textiles-EU19.

IPC and Automotive Industry Action Group Enhance Partnership Agreement

“Direct part” manufacturing suppliers offered complimentary AIAG membership

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.                                  

To reinforce the importance of quality in process and manufacturing, standardization for supply chain effectiveness and industry advancement, IPC and the Automotive Industry Action Group (AIAG) renewed their cooperative agreement. As part of the agreement, IPC and AIAG agreed to work closely in the areas of thought leadership, quality and supply chain best practices, and community awareness building. Together, the industry associations will educate the automotive supply chain on compliance requirements, evaluate how IPC standards and AIAG guidelines align and impact both industries, and work together to identify training that builds on professional standards.

“Today’s automobiles contain multiple electronics systems that control or monitor all aspects of the vehicle, and the quality and security of vehicle software and electronics are key requirements to guarantee safety,” said Tracy Riggan, senior director, Solutions, IPC. “The partnership of IPC and AIAG will enable both organizations to share, support and develop standards and education, and participate in industry research.”

“We maintain very close working relationships with industry associations that serve the needs of the automotive industry, and believe IPC will be a key partner in representing the electronics supplier segment,” explained AIAG vice president of member services, Dave Lalain. “We’ve already invited IPC to support our Electronics Advisory Board and are looking forward to their involvement in bringing electronics supplier issues to the forefront.”

Part of the IPC AIAG partnership includes an opportunity for complimentary AIAG membership for direct suppliers to the automotive industry. To complement the supplier tools shared by IPC and AIAG and to help the supply base improve, any direct suppliers with under $20 million in global annual sales are eligible.

To apply for AIAG membership and find out if you qualify for the IPC-sponsored membership, go to http://go.aiag.org/joinipc. Additionally, AIAG members are invited to join IPC and all new members receive 50 percent off the first year’s membership. To apply or learn more, www.ipc.org/membership.

IPC CEMAC 2019 Showcases Intelligent Future Driven by Data

More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.

Peter Chiang, vice president, IPC Greater China, opened the annual members-only event, with an introduction to the implementation of Industry 4.0 and release of IPC-2591, IPC’s connected factory exchange standard. Huang Chunguang, Huawei Technologies, Co. Ltd., discussed the important role of 3D digitalization of electronics components during his presentation, “Software Defines Manufacturing, Data Drives the Future.” Luo Jiapeng, Foxconn, introduced Foxconn’s SMT Industrial Internet blueprint and framework during his presentation, “Data -- the Foundation of Intelligent Manufacturing.”

In addition, presentations were given by: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Chen Zhiman, CRRC Times Electric; Johnsson Per Anders, JWI Software; Liu Fengshou, Vayo; and Du Yunliang, Mentor Graphics – a subsidiary of Siemens. The event provided ample time for professionals from various industries including aerospace, railway, telecommunication and electronics manufacturing to network with speakers.

“China accounts for up to 38 percent of the global electronics industry production capacity of nearly 2 trillion USD,” said David Bergman, IPC vice president, standards and training. “The rapidly growing Chinese electronics industry market share creates opportunities and challenges for domestic electronics-related enterprises. As a global electronics industry association, IPC is committed to the promotion of technical exchanges and providing enterprises with the latest technical standards and training to drive further development of the industry. IPC’s annual CEMAC event provides the perfect backdrop for these technical exchanges.”

Next year’s IPC CEMAC will be located in Shanghai. For more information about this event or other IPC-sponsored events in Asia Pacific, visit  www.ipc.org.cn 

North American PCB Sales Decline, Following Negative Order Growth

IPC Releases PCB Industry Results for July 2019

IPC announced today the July 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales growth in July turned negative, following order growth into negative territory. The book-to-bill ratio remained at parity (1.00).

Total North American PCB shipments in July 2019 were down 5.3 percent compared to the same month last year. Year-to-date sales growth as of July remained positive at 8.3 percent. Compared to the preceding month, July shipments decreased 23.1 percent.

PCB bookings in July decreased 4.3 percent year-over-year, bringing year-to-date order growth down to a positive 1.2 percent. Bookings in July were down 17.8 percent from the previous month.

“Year-on-year declines in orders in seven of the last 12 months are taking a toll on sales growth in the North American PCB industry,” said Sharon Starr, IPC’s director of market research. “Sales growth has slowed in recent months and dipped into negative territory in July. The slowdown is reflected in the book-to-bill ratio, which has hovered around 1.00 in the last five months. This indicates the probability of flattening sales growth in the second half of the year.”


Note: The January 2019 ratio has been revised since its original publication due to updated data from statistical program participants.


Note: The November 2018, January 2019 and June 2019 growth rates have been revised since their original publication due to updated data from statistical program participants.

View Chart in PDF

Detailed Data Available

The third-quarter 2019 edition of IPC’s North American PCB Market Report, containing detailed data from IPC’s PCB Statistical Program, will be published by mid-November. The quarterly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. PCB companies that are IPC members doing business in North America are invited to contact marketresearch@ipc.org for information about participating. More information about this report can be found at www.ipc.org/market-research-reports.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.