The Global Electronics Association announces its APEX EXPO keynote lineup, featuring industry titans exploring the frontiers of quantum computing, artificial intelligence, and the electrification of global industries.
Turning Supply Chain Security into Business Value: Only Non-IT Personnel Must Achieve It. IPC-1792 Implementation Guide
Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer missteps, and clearer requirements for IT and security teams.
IPC India Regional Team
The 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.
On the eve of IPC Day EMS Europe, more than 90 executives from leading EMS and PCB manufacturing companies came together aboard the elegant Onyx cruise ship for the EMS Presidents’ Dinner. Hosted by the Global Electronics Association in partnership with in4ma and IFTEC, the exclusive evening offered a unique mix of networking, knowledge exchange, and cultural experience.
In conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.
The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.
Last week, Kelly Scanlon, the Global Electronics Association's lead sustainability strategist, represented the Association’s Evolve program at SERI’s e-Summit.
Join fellow EMS leaders in the region to share industry pain points and solutions.
Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.
Perfect for engineers navigating next-gen packaging and reliability.