The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.
GEA India & SEA Regional Team
The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.
There are moments when an industry stops reacting and starts shaping its own future. For European electronics, that moment comes to Paris on 17 September, with Electronics Day EMS Europe, a full day dedicated to the businesses, the people and the policies driving European electronics manufacturing forward.
The Global Electronics Association will participate in electronica 2026, taking place November 10–13, 2026, at the Trade Fair Center Messe München in Munich, Germany.
The Connection Between Online Courses to IPC Standards for Successful PCB Design
Whether you're new to PCB design or looking to advance your expertise, understanding IPC Standards is essential for creating reliable, manufacturable, and high-quality printed circuit boards.
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
AI-Enabled Electronics Manufacturing: Applications in Quality and Root-Cause Analysis
How AI can help electronics manufacturing teams use data, knowledge, and experience to make more informed operational decisions
Electronics manufacturing teams are under increasing pressure to improve quality, reduce defect escapes, respond quickly to customer requirements, and make better day-to-day decisions across complex manufacturing operations. At the same time, the information needed to make those decisions is often distributed across inspection systems, process logs, equipment data, engineering specifications, FMEAs, corrective-action records, customer requirements, and other technical documentation. The challenge is not simply having more data; it is turning fragmented information and technical knowledge into practical, trustworthy decision support.
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
European industry leaders converged in Brussels to align on Chips Act 2.0, calling for an integrated electronics strategy spanning PCBs, EMS, AI, defence, and automotive.