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U.S. May Investigate Chinese Subsidies to Domestic Companies

The Biden administration, as part of its review of the U.S. relationship with China, is considering initiating a new probe under Section 301 of the Trade Act of 1974 into subsidies paid by the Chinese government, though no announcements or actions have yet been taken. Findings of unfair subsidies could lead to additional tariffs or further trade restrictions taken against China.

Automotive and Electronics Industries Convene to Prioritize Challenges

Representatives from global companies across the value chain were invited by AIAG, IPC, and SEMI to discuss and consider industry challenges by their importance as well as the feasibility of solutions.

IPC and Partners Foresee New Industry Burdens, Limited Benefits from EPA’s Proposed PFAS Reporting Rule

On September 27, IPC submitted comments on a proposed rule from the U.S. Environmental Protection Agency (EPA) on reporting and recordkeeping requirements for per- and polyfluoroalkyl substances (PFAS) under the Toxic Substances Control Act (TSCA).

IPC Concerned Over EEE Criteria in EU Sustainability Regulation

IPC Concerned over EEE Criteria in EU Sustainability Regulation

IPC’s Industry Intelligence Initiatives for for Global Electronics Manufacturers

IPC wants members to have up-to-date, critical economic and operational data to help them make decisions about their day-to-day business operations. To that end, IPC created the IPC Economic Outlook and Global Sentiment Supply Chain Reports, monthly updates for the global electronics manufacturing industry. IPC President and CEO John Mitchell provides details.

Sanctions on Russia Include Electronics-Related Export Controls

Over the last week, the United States, United Kingdom, European Union, and several other countries and organizations have imposed severe and immediate sanctions against Russia for its invasion of Ukraine.

iNEMI Shares Hybrid PCB Survey Results

iNEMI’s PCB & Laminates Technology Integration Group (TIG) has identified thermoset hybrid PCB reliability as a critical focus area.

Automated Optical Inspection: Implications on Board Assembly

The International Electronics Manufacturing Initiative (iNEMI) is conducting an industry-wide survey to assess the development of artificial intelligence (AI) and its implementation for automated optical inspection (AOI) in board assembly. 

Four Things to Know About IPC’s Recently Released “Quality Benchmarks for the Electronics Assembly Industry”

IPC has recently released “Quality Benchmarks for the Electronics Assembly Industry,” a biennial report that compiles and analyzes survey results from over 50 assembly companies, mostly comprised of contract electronics manufacturing service (EMS) companies and original equipment manufacturers (OEMs).

Beyond Moore’s Law – Enabling Heterogeneous Integration and Next Generation Chiplet Architectures

The Hall of Fame Council, key contributors to IPC, and members from diverse backgrounds in electronics manufacturing provide strong backing and support for the IPC effort, with members of the group committed to helping in several ways.

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