IPC 攜手 TEEMA、III 共建 EMS 智慧製造 AI 資料庫，簽署策略合作備忘錄（MOU）
IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. This compact 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.
Las empresas que invierten en formación para la incorporación de personal reducen significativamente el tiempo hasta la plena productividad, el retrabajo, los plazos de entrega y la rotación de personal.
This webinar will preview the IPC APEX EXPO 2023 professional development course, “Preventing Product Failure and Manufacturing Defects.” Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects and product reliability issues that affect the first-pass yield/cost/performance by understanding potential causes and plausible solutions.
Join Madison Maxey, founder and technical lead of Loomia, as she shares highlights of her IPC APEX EXPO 2023 professional development course. The course provides a primer to electrical and mechanical engineers -as well as product designers - on how to engage with electronic textiles for new product development. Attendees should walk away with a clear picture of when electronic textiles may be relevant to their engineering, which type of technology is ideal for their application, and how to thoroughly evaluate a technology when selected.
This webinar will preview the IPC APEX EXPO 2023 professional development course, “Troubleshooting SMT Yield Problems and Failure Analysis." Join Ray Prasad for this webinar and get an exclusive "sneak peak" on:
Advancing your understanding of root causes of SMT and through hole defects
Implementing corrective actions in design, assembly and material purchases
Taking necessary actions to improve yield and reduce product cost.
You are also encouraged to bring your pesky defects for discussion and root cause analysis.
Review historical timeline of the research in this area. Join Dr. Syed Sajid Ahmad, Ph.D summarize and present pertinent results including the means & actions proposed and tried to alleviate the adverse effects of the Kirkendall voiding caused by the phenomenon. What promotes purple plague. How to control its formation and growth. Observation and measurement methods. Interface analysis techniques. Methods of failure analysis.
IPC WINTERCOM Committee Meetings 2024
IPC Day Romania: Build Electronics Better with Standards and Solutions, Powered by Flex, is a conference providing unique opportunities to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.
Wondering how to make the most of your IPC membership? We can help.
This free 30-minute webinar presented by Logan Smith, Member and Customer Support Team Lead, will show you how to navigate the membership website pages to access all your benefits and how to participate in all the activities that IPC membership has to offer.