In the intricate world of electronics manufacturing process and precision are not just goals; they are necessities. Amidst the myriad of factors that can affect the quality and reliability of electronic products, one critical issue can go unnoticed – Foreign Object Debris (FOD). Though seemingly insignificant, FOD can have profound implications on the manufacturing process and the end products. This post delves into why managing FOD is pivotal in electronics manufacturing.
“Made in India” was a central phrase at EWPTE 2024. The wire harness event hosted the inaugural “India Pavilion” which showcased Indian wire harness companies on the exhibit floor. The Pavilion was opened with pomp and circumstance by the Wire Harness Manufacturer’s Association (WHMA) Board Chair, David Bergman on Wednesday, May 15 with a ribbon-cutting ceremony. The show shone the spotlight on 15 exhibiting companies from India entering the North American market.
Welcome to Industry Intelligence Insights, your monthly guide to the trends and data shaping the global electronics manufacturing landscape.
The last month has demonstrated that the era of smooth globalization may be waning, and electronics manufacturers will need to learn to thrive in a world of persistent uncertainty.
As global supply chains have grown increasingly complex, policymakers, industry, and civil society have been looking for ways to use supply chain requirements to reduce the negative environmental and social effects of the products we consume.
On 11 June 2021, the German Supply Chain Act was adopted by the German Parliament by a large majority, introducing binding human rights and environmental due diligence obligations for companies. After lengthy and difficult negotiations, the political groups found compromises on several key aspects of the law ranging from the scope of companies covered to the question of liability. The aim of the law is to foster responsible business conduct and remove illicit practices such as child labour from supply chains.
The International Material Data System (IMDS) has been the global automotive product declaration system for more than 20 years. With over 200,000 companies collecting about 90M declarations, the automotive industry has gathered unparalleled information about product and material content.
High-Density Packaging (HDP) User Group is hosting a free webinar that will provide its members and others in the electronics industry the latest information on issues facing aerospace electronics. Worldwide experts in the field will share their knowledge and concerns during the 3-hour webinar, which is open to all interested parties.
Carrie Sessine, Chief Communications Officer, shares her Top Reads
Congressional staff continue to work behind the scenes in preparation for the post-election final legislative push of 2024.