The Corporate Sustainability Due Diligence Directive (CSDDD) is a European Union directive that introduces legal obligations on businesses to respect human rights and the environment.
Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to share industry pain points and solutions.
Turning Supply Chain Security into Business Value: Only Non-IT Personnel Must Achieve It. IPC-1792 Implementation Guide
Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer missteps, and clearer requirements for IT and security teams.
This webinar, co-hosted by the Global Electronics Association and Anthesis Group, will offer an update on the current state-of-play on emerging circularity policies for electronics to interested stakeholders, from an advocacy, compliance, and standards development perspective.
IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. This compact 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.
Las empresas que invierten en formación para la incorporación de personal reducen significativamente el tiempo hasta la plena productividad, el retrabajo, los plazos de entrega y la rotación de personal.
This course provides the skills necessary to effectively implement designs requiring embedded components in accordance with product requirements.