Data-driven manufacturing is revolutionizing the industry, improving quality, productivity and agility, while also decreasing production costs and ordering lead-times. In sectors requiring a very high degree of security within manufacturing and of product data, the adoption of Smart Manufacturing solutions has been severely limited. As a result, many companies in the electronics manufacturing industry, especially those in high-security sectors, are left with an increasing gap in terms of competitiveness, leading to relatively increased costs and a lack of flexibility.
IPC Connected Factory Exchange (IPC-CFX), an open industry standard for shop floor communication, provides a whole new mechanism of secure data transfer, as well as the ability to securely bridge the “air-gap” between the operational shop floor and secure business systems.
In this webinar, we will explain the issues around internal factory security and how any company can leverage the secure encryption and standardized equipment messaging of IPC-CFX in security-critical manufacturing environments to support Smart Industry 4.0 initiatives and data collection and analysis, without risk of compromise.
Can't make the live session? No problem! Register and you will receive a recording this presentation via email.
This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.
IPC has developed an annual international networking forum in India RegionIntegrated Electronics Manufacturing & Interconnections (IEMI). The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
IPC has developed an annual international networking forum in India Region Integrated Electronics Manufacturing & Interconnections (IEMI). Event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.
This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.
Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.
Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.
When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.
Join IPC at Global Industrie March 25-28 in Paris, when we will host the IPC Forum, a program covering all aspects of the electronics manufacturing industry. Meet the best experts in the industry presenting on key industry topics.
A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.
Panelists include:
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 - May 1, 2024, at The Westin Arlington, Arlington, VA.