This webinar, co-hosted by the Global Electronics Association and Anthesis Group, will offer an update on the current state-of-play on emerging circularity policies for electronics to interested stakeholders, from an advocacy, compliance, and standards development perspective.
IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. This compact 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.
Las empresas que invierten en formación para la incorporación de personal reducen significativamente el tiempo hasta la plena productividad, el retrabajo, los plazos de entrega y la rotación de personal.
This course provides the skills necessary to effectively implement designs requiring embedded components in accordance with product requirements.
This course provides the skills necessary to effectively implement designs requiring flex and rigidflex circuits in accordance with product requirements.
Advance in a New Era at IPC APEX EXPO 2023
Join IPC on Thursday, March 10 at 1 pm EST for a discussion with Mr. Gary Stanley on newly imposed export controls related to the conflict in Ukraine. IPC recommends that industry review and understand the new export controls to ensure full compliance with them.
Join the world’s leading environmental regulatory experts at IPC and ITI’s virtual 2022 Critical Environmental Requirements for Electronics Conference for updates on the latest environmental requirements that could impact your product’s design, manufacturing, supply chain management, and technology innovation.
4.00 PM: Welcome Address by Mr Rajiv Nath, Forum Coordinator, Association of Indian Medical Device Industry (AIMED) & Mr. G V Subrahmanyam, Jt. Coordinator, EVG, AiMeD
This course provides the skills necessary to create PWB/PBA designs that require advanced or complex packaging.