IPC applauds Chairman Jason Smith (R-MO) and the House Ways and Means Committee for advancing legislation that includes several top priorities for U.S. electronics manufacturers.
Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.
The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. We are proud to have championed this comprehensive approach to the electronics ecosystem over many years, including in our recent industry reports and stakeholder meetings with the European Commission.
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
The Global Electronics Association announced today the March 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
The Global Electronics Association announced today the June 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.49.