Submit a Standards Improvement Comment
IPC Status of Standardization
Contribute to IPC Standards by Submitting Your Comments
Individuals or companies are invited to submit a comment to the Global Electronics Association on IPC standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate IPC technical committee with input from the industry regarding recommendations for published standards or work in progress on new or revised standards. Complete the form on the right and just click on the submit button. A tech staff person will be in touch if there are any questions.
Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, and manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards, but we are also looking for what might be the next standard for the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted, a project is established, and the great work of the industry committees starts.
The Global Electronics Association encourages and welcomes individuals from the electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process.
If you are located in Asia Pacific Market -
IPC members in China and Asia are invited to participate in the TGAsia Forum, our email forum for discussing standards development.
IPC Standardization Procedures - provides processes, structure, and ANSI policy in developing standards for the global electronics industry
Status of Standardization
Standard | Title | Published Date |
---|---|---|
IPC-A-600M | Acceptability of Printed Boards | May 2025 |
IPC/JPCA-8911 | Requirements for Conductive Yarns for E-Textiles Applications | May 2025 |
IPC-4203C | Cover and Bonding Material for Flexible Printed Circuitry | April 2025 |
IPC-6011 Rev A to Rev B - Redline | Generic Performance Specification for Printed Boards | April 2025 |
IPC-8981 | Quality and Reliability of E-Textiles Wearables | March 2025 |
Standard | Title | Published Date |
---|---|---|
No entries available. |
Standard | Title | |
---|---|---|
IPC-4101F | Specifications for Base Materials for Rigid and Multilayer Printed Boards | |
IPC-4204C | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards | |
IPC-4556A | Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards | |
IPC-6012FA | Automotive Applications Addendum to IPC-6012F | |
IPC-7527A | Requirements for Solder Paste Application | |
IPC-9242 | Guidelines for Microsection Evaluation | |
IPC-9271 | Guidelines for In-System Programming | |
IPC-9691C | User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing | |
IPC-A-630A | Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures | |
IPC-J-STD-002F | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires | |
J-STD-001JA/IPC-A-610JA | Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies | |
Standard | Title | |
---|---|---|
IPC-1401B | Corporate Social Responsibility Management System Standard | |
IPC-1753 WAM2 | Laboratory Report Standard | |
IPC-1755B | Responsible Sourcing of Minerals Data Exchange Standard | |
IPC-1791E | Trusted Electronic Designer, Fabricator and Assembler Requirements | |
IPC-2223F | Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards | |
IPC-2601 | Electronic Product Documentation Standard | |
IPC-4413 - Am1 | Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards | |
IPC-6013F | Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards | |
IPC-6018D Amendment 1 | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards | |
IPC-6921 | Requirements and Acceptance for Organic IC Substrates | |
IPC-9541 | Acceptability of System in Package (SIP) Product | |
IPC-9704B | Printed Circuit Assembly Strain Gage Test Guideline | |
IPC-HDBK-005A | Guide to Solder Paste Assessment | |
IPC-HDBK-9798A | Handbook and Guide to Supplement IPC-9797 | |
IPC-T-50P | Terms and Definitions for Interconnecting and Packaging Electronic Circuits | |
IPC/WHMA-A-620F | Requirements and Acceptance for Cable and Wire Harness Assemblies | |
J-STD-046A | Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers | |
J-STD-048A | Notification Standard for Product Discontinuance | |
J-STD-075B | Classification of Non-IC Electronic Components for Assembly Processes | |
Standard | Title | |
---|---|---|
IPC -1751B | Generic Requirements for Declaration Process Management | |
IPC-1752C | Materials Declaration Management | |
IPC-1753A | Laboratory Report Standard | |
IPC-1757 | Process Chemicals Declaration Standard | |
IPC-1782C | Standard for Manufacturing and Supply Chain Traceability of Electronic Products | |
IPC-1783 | International Standard for Component-Level Authentication (CLA) | |
IPC-2553 | Model-Based Board-Level Virtual Verification Guidelines for Finite Element Analysis and Board-Level Reliability | |
IPC-2592 | Digital Credentials Exchange (DCX) | |
IPC-4103C | Specification for Base Materials for High Speed/High Frequency Applications | |
IPC-4414 | Specification for Finished Fabric Woven from Ultra - Low Dk Glass for Printed Boards | |
IPC-4562C | Metal Foil for Printed Board Applications | |
IPC-6012F Am1 | Qualification and Performance Specification for Rigid Printed Boards | |
IPC-6018E | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards | |
IPC-6019 | Qualification and Performance Specification for Ultra High Density Interconnect (uHDI) Printed Boards | |
IPC-6921 | 有机封装基板的要求与验收 Requirements and Acceptance Specification for Organic IC Substrate | |
IPC-6931 | Requirements and Acceptance of Optical Module Printed Boards | |
IPC-7251 | Generic Requirements for Through-Hole Design and Land Pattern Standard | |
IPC-7621A | Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics | |
IPC-8921A | Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires | |
IPC-8922 | Qualification and Performance Specification for Printed Electronics on Coated or Treated Textiles and E-Textiles | |
IPC-8953 | Design Standard for Embroidered E-Textiles | |
IPC-8961 | Guideline on E-Textiles Wearables | |
IPC-9711 | Generic Requirements for Automated Inspection Process Control | |
IPC-9716A | Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies | |
IPC-A-610JC | Telecom Addendum to IPC-A-610 Revision J Acceptability of Electronic Assemblies | |
IPC-AJ-820B | Assembly and Joining Manual | |
IPC-CH-65C | Guidelines for Cleaning of Printed Boards and Assemblies | |
IPC-HDBK-620A | Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620 | |
IPC-SM-840F | Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials | |
IPC/DAC-2552A | General Electronic Components Model Based Definition (MBD) Standard | |
IPC/JEDEC-9702A | Monotonic Bend Characterization of Board-Level Interconnects | |
J-STD-001KS | Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies | |
Standard | Title | |
---|---|---|
IPC-2201 | Requirements for Physics of Failure Analysis for Components and Assemblies | |
IPC-2611A | Generic Requirements for Electronic Product Documentation | |
IPC-2612-1A | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology | |
IPC-2612A | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) | |
IPC-4557 | Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications | |
IPC-6911 | Acceptability of Additively Manufactured Electronics (AME) | |
IPC-7070 | Guidelines for Printed Board Component Mounting | |
IPC-7077 | Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly | |
IPC-9205 | Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes | |
IPC-HDBK-001A | Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A | |
IPC/JEDEC J-STD-033E | Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices | |
IPC/JEDEC J-STD-609C | Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly | |
Standard | Title |
---|---|
No entries available. |
Standard | Title |
---|---|
No entries available. |
Standard | Title |
---|---|
No entries available. |
Standard | Title |
---|---|
No entries available. |
Standard | Title |
---|---|
No entries available. |