Global Electronics Association Knowledge Hub

A new hybrid ALD/CVD protective coating is being considered as a low-cost alternative to poly-para-xylylene and traditional liquid conformal coatings. All of the typical conformal coatings prot .. read more

Very low viscosity formulations are often required for very thin conformal coating applications. Solvents are used to reduce viscosity of the formulations and accommodate dispensing needs. Solv .. read more

High reliability process automation devices require serious protection from harsh environments which can be a combination of moisture,corrosive gases and liquids,salt sprays,large temperature v .. read more

Solder paste has been used in the surface mount technology for many years. However,a complete understanding of the effect of key powder characteristics on the paste properties is still not achi .. read more

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder p .. read more

It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th .. read more

Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi .. read more

The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin sys .. read more

IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t .. read more

The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted .. read more

This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2 .. read more

From photo film to digital camera,from letters to emails,from books to e-readers,from vinyl to MP3: the whole world is turning digital. Yet,ironically,the core compound driving the digitization .. read more

The rules of the game in PCB production are changing with new disruptive technologies. At the company there has been the implementation of a “primary image inkjet-resist” printer for both inner .. read more

With increasing popularity and momentum for wearable and printed electronics,stretchable printed ink has become a hot subject for study and application. Circuitry printed from stretchable ink r .. read more

In 2012,The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to b .. read more

One of the biggest challenges a corporate environmental compliance team faces is to collect complete and accurate material and substance data in a timely manner from suppliers. This paper will .. read more

Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and fro .. read more

Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres .. read more

As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push t .. read more

Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi .. read more

In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand .. read more

From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou .. read more

Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo .. read more

Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main .. read more

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Und .. read more

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in .. read more

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a .. read more

High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation .. read more

Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde .. read more

Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis .. read more

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos .. read more

Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp .. read more

Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri .. read more

Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l .. read more

Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some .. read more

Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t .. read more

The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi .. read more

In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar .. read more

In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar .. read more

Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from cre .. read more

In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little (ADL) [1] re .. read more

The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i .. read more

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a .. read more

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly .. read more

With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In .. read more

While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for .. read more

The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact .. read more

With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au .. read more

Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of .. read more

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni .. read more