Global Electronics Association Knowledge Hub

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e .. read more

Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh .. read more

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. read more

It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically .. read more

Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S .. read more

Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou .. read more

Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting .. read more

Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack .. read more

Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN .. read more

In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man .. read more

Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro .. read more

Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def .. read more

A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo .. read more

Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life .. read more

During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be .. read more

Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and .. read more

Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some .. read more

In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi .. read more

The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res .. read more

Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co .. read more

Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe .. read more

Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan .. read more

Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead .. read more

A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r .. read more

In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de .. read more

Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r .. read more

Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing, .. read more

Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co .. read more

Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas .. read more

When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task. .. read more

The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse .. read more

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no .. read more

This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d .. read more

One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey .. read more

Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known .. read more

Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve .. read more

Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC .. read more

Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch .. read more

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d .. read more

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may .. read more

The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr .. read more

Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l .. read more

For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all .. read more

Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields .. read more

The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h .. read more

To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m .. read more

Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa .. read more

This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly .. read more

With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti .. read more

As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther .. read more