Global Electronics Association Knowledge Hub

Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex .. read more

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha .. read more

It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t .. read more

In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. .. read more

As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th .. read more

Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa .. read more

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu .. read more

Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations .. read more

Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o .. read more

One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el .. read more

Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app .. read more

Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu .. read more

Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co .. read more

Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar .. read more

Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i .. read more

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t .. read more

Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ .. read more

The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of .. read more

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package- .. read more

Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin .. read more

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such .. read more

The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding .. read more

Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or .. read more

The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so .. read more

The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density .. read more

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci .. read more

Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d .. read more

The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc .. read more

Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r .. read more

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ .. read more

PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio .. read more

PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great .. read more

Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of .. read more

With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific .. read more

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide .. read more

A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d .. read more

Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec .. read more

Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with .. read more

While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation a .. read more

The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r .. read more

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free .. read more

Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df .. read more

As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit .. read more

Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in v .. read more

Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems,which need frequent readjustments as models .. read more

Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required .. read more

There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a “one and done” ass .. read more

More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm .. read more

The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the ex .. read more

Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro .. read more