Global Electronics Association Knowledge Hub

Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a .. read more

With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan .. read more

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang .. read more

As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold .. read more

This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin fluoropolymer film as a protective coating to preserve solderabilit .. read more

We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electrole .. read more

Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application,the TBBPA is fully reacted into the epoxy resins that form t .. read more

Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has already been not satisfied with double sided design and requested thinner & mul .. read more

There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be .. read more

Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal .. read more

– Define Printed Electronics – Provide general market information & Applications – Provide performance information on a wide variety of thermoplastic films – Provide processing considerations f .. read more

Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c .. read more

• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing • Discussion of requirements for understanding the technology of the .. read more

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology. .. read more

The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations. .. read more

Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i .. read more

In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and .. read more

Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin .. read more

Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo .. read more

Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to .. read more

The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre .. read more

There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th .. read more

Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat .. read more

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si .. read more

With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT. .. read more

SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements .. read more

The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon .. read more

The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon .. read more

European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig .. read more

Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so .. read more

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. read more

The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc .. read more

Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed .. read more

As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on .. read more

High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi .. read more

Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed .. read more

The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco .. read more

Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa .. read more

Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder .. read more

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si .. read more

The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad .. read more

Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially .. read more

As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics .. read more

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•Overview •Test Method Considerations •Proposed Test Methodology •PCB,Stencil & Part Information •Pick-up Adapter Design •Test Setup Overview •Head-in-Pillow Defect Detection •Test Parameters • .. read more

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

In recent years the PCB industry has increasingly turned to digital,or maskless,imaging techniques in order meet demands for tighter registration between layers. Many of these techniques,includ .. read more

After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF) solders,tin and its alloys have come to the forefront as the first choi .. read more

3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi .. read more

A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above? Unplanned downtime is a costly fact of life. In order t .. read more