Global Electronics Association Knowledge Hub

Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas .. read more

In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli .. read more

This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h .. read more

• The Information Process • Knowing the jargon (terms & definitions) • Defining the requirements • Expansion of Documentation standards • Document Grade and Completeness • Relationship of CAD/C .. read more

• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly. • Other areas covered include board base material type and sur .. read more

Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal management. Conductor temperature rise as a function of current is depe .. read more

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Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. read more

In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains .. read more

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to .. read more

- Production Processes - Manual Production Line (2000) - Fully Automated System (today) - Cell Interconnection - Encapsulation Materials - Encapsulation Process - Influence of Temperature - Enc .. read more

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With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive environments,the electronics industry is observing increased occurrences o .. read more

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. read more

Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a .. read more

The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product .. read more

This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials .. read more

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days,components were fairly large,m .. read more

Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics packaging design using smaller components with greater I/Os assembled .. read more

Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also .. read more

Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use .. read more

Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr .. read more

The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the .. read more

The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o .. read more

One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag .. read more

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. read more

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. read more

An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame retardant epoxy resins use bromine-containing flame-retardants. In t .. read more

Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto .. read more

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro .. read more

It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends .. read more

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. read more

Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The failure mechanisms and root causes are not yet fully understood,and l .. read more

The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle .. read more

The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that each new generation of products furnish greater functionality. The minia .. read more

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. read more

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensiv .. read more

Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined .. read more

Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo .. read more

Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec .. read more

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a .. read more

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. read more

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In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production. .. read more

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This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t .. read more

- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly .. read more

Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o .. read more

Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave .. read more