Global Electronics Association Knowledge Hub

•The 2011 iNEMI Solar PV roadmap •Involvement of the electronics supply chain •Example of an electronics opportunity – micro-inverters .. read more

•A vision of a solar-powered world •Importance of reliability to success of solar •Working together to establish reliability •R&D issues related to: •Product Development •Quality Assurance duri .. read more

- Solar Module Assembly vs. PCBA - Crystalline Silicon Module (c-Si) Construction - Module Assembly Process (c-Si) - PV Cells – String - Array - Module - Tab & String Process - Lamination Proce .. read more

Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s .. read more

From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working .. read more

This paper will discuss the environmental and financial cost of operating both batch cleaners and small inline aqueous cleaners. It is not the goal of this paper to endorse one type of cleaner .. read more

Since the European Union (EU) first published the Restriction on the use of Certain Hazardous Substances in electrical and electronic equipment directive (RoHS) in 2003,the document required up .. read more

Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so .. read more

The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids .. read more

Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha .. read more

As the assembly of electronic products becomes more automated the collection,storage and retrieval of electronic data demands additional software tools to manage data. The wide spread use of we .. read more

In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf .. read more

In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c .. read more

With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems. Insertion loss can be separated into dielectric loss and copper loss. While dielectric l .. read more

Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount .. read more

With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010 .. read more

Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free solder ball alloys based on the improved mechanical shock resistance. Althou .. read more

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are .. read more

High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur .. read more

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. read more

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. read more

We describe a coupon design that makes available,in an elegant and efficient way,information unattainable even from multiple-coupon vertical cross-sections. The new design allows quantitative d .. read more

The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap .. read more

Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical .. read more

In electronics design,Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet,a part has a third view,whic .. read more

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu .. read more

Sculpted Flex Circuits are a very cost effective,low profile termination solution that is not very well known. These Flex Circuit hybrids can provide the user a simple interconnection between c .. read more

Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive or no .. read more

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. read more

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in .. read more

- Background: What is a void? - What is a "macro" void? - What is a “planar” void? - What is a “shrinkage” void? - What is a “microvia” void? - What is a “pinhole” void? - What is a “Kirkendall .. read more

•Board-level drop shock test was performed on 9 assemblies –63 parts / board –Parts representative of military package styles •Assembled on Pb-free compatible laminate with SAC 305 solder •Sele .. read more

The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers. .. read more

- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies. •Hillock and whisker .. read more

- Regulations are driving increasing IPC-1752 use - More restricted substances and product categories in scope - The business challenge is much bigger than “regulatory compliance” - Teams incre .. read more

In globally competitive markets,managing product quality,reliability and risk is not an option. However,it also brings its own unique set of challenges to complex organizations: - Product desig .. read more

The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram .. read more

Using X-ray imaging,solder corrosion,resembling metal migration,had been observed under QFN (Quad Flat No-Lead package) devices and chip resistors on circuit boards that were processed with two .. read more

• Genesis in December 2008 • Follow-up discussions APEX 2009 • Input received from SMEs • Conference Call July 22,2009 • Discussions IPC Midwest 2009 • First white paper issued by IPC SPVC June .. read more

Like many other electronics industries,the automotive electronics industry has long been concerned about ESD. As dramatically seen in the news today,quality recalls can detrimentally affect the .. read more

BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily .. read more

High reliability applications in the military and aerospace industry require reliable solder finish identification on components within the supply system of DoD,NASA,and many other organization .. read more

As margins on electronics technology have continued to erode,an increasing number of organizations have implemented design for reliability practices to ensure device performance while meeting t .. read more

Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical .. read more

The growing complexity of electronic assemblies increases the cleaning challenge due to miniaturization,lower component gaps,and improved flux designs. The need to remove ionizable contaminants .. read more

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. read more

Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th .. read more

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Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient .. read more

An overview of previous work regarding light enegine development is provided,proceeded by an in-depth overview of new technology available for solder mask imaging. .. read more