Global Electronics Association Knowledge Hub

With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability .. read more

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi .. read more

Electronics manufacturing process engineers are faced with significant challenges when selecting a cleaning system as a consequence of the wide ranges of cleaning processes and equipment. Curre .. read more

Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as .. read more

Manufacturers of electronic devices are always searching for new technologies that can improve processes,extend capabilities and lower costs. These drivers,along with the needs of new markets l .. read more

For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics miniaturization and densification. Numerous technologies issued from v .. read more

Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi .. read more

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi .. read more

Mixing PCB Design Layout units will compromise perfection every time. PCB Design perfection starts with building CAD library parts and quickly moves to part placement,via fanout and trace routi .. read more

Predicting the electrical performance of embedded capacitor PCB designs has been a major stumbling block for the technology. In particular,one of the key questions has been how quickly can char .. read more

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. read more

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N .. read more

Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a .. read more

The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of electroless copper deposition. Conventional electroless copper plating sol .. read more

Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva .. read more

While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to .. read more

The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see .. read more

Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d .. read more

The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign .. read more

This paper details a break-through technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs of - "faster,cheaper,and smaller". The new fixture .. read more

This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai .. read more

Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging .. read more

Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by passing them together across the flowing surface of a molten solder reservo .. read more

•Background information •Scope of the problem –Anecdotal –Study by International Chamber of Commerce –Recent study US Dept of Commerce •What to do about it ? –“Findings” and “Best Practices” •T .. read more

Counterfeiting is clearly a growing problem in many industries,including electronics,around the world. As the financial impact of counterfeiting has grown over the years,so has the attention th .. read more

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c .. read more

Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been concern about the possibility of circuit malfunctions due to whisker .. read more

RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be .. read more

This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit Assembly (PCA) testing utilizing the test access port (TAP) defined in .. read more

Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition .. read more

“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the automotive electronics industry. The result has been numerous plant closings an .. read more

One of the effects of the ever increasing mountain of regulatory requirements and the globalization of markets is the need to disseminate and collect information across the shop floor and the e .. read more

One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.” Head-in-Pillow (HnP) defects occur on the blind solder joints of area .. read more

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in .. read more

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. read more

Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic .. read more

Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met .. read more

Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The .. read more

Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i .. read more

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00 .. read more

Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of engineering materials. In the harsh economic climate facing manufacturing .. read more

Examples of various parts machined by PCM processes are featured. .. read more

Examples of various types of parts machined through PCM processes are described. .. read more

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include .. read more

Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different X and Y locations. In Package on Package (PoP) assembly,components are .. read more

As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no .. read more

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad .. read more

Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher frequency and higher power requirements. These power and frequency demands .. read more