Global Electronics Association Knowledge Hub

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Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces .. read more

The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design, aperture design,board finish,type of solder paste,pick-and-place,and reflow pro .. read more

The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature components. To satisfy this demand,01005 chip components are now commercia .. read more

Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process parameters emerge and old process parameters become significantly m .. read more

As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save board area. Two common solutions are the use of embedded passives and the use of .. read more

Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no requirement to report the DK and DF of the glass formulation used to produce E- .. read more

New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting resin system. They are composed of various lineups with the same r .. read more

The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new slash sheets describing FR-4 base materials compatible with lead-free a .. read more

Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a robust and effective substrate for circuit boards. In such applications,relia .. read more

The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the development of smaller and smaller components and the continued difficulty o .. read more

The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues to increase due to the fact that this package type allows for a greate .. read more

PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect on the long term solder joint reliability of the BGAs. This study is foc .. read more

As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker mitigation strategies have been adopted by the component manufactures, .. read more

This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the iNEMI User Group that pure tin electroplating presents a risk in high .. read more

One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of “snapping” the shell-like shields onto solder spheres that are .. read more

As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical interconnects and substrate technologies become increasingly important. Flip ch .. read more

Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik .. read more

Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi .. read more

Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other environmentally friendly materials. This massive effort has resulted in n .. read more

Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning lead-bearing electronic products (with a few exemptions) in the Eur .. read more

A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently introduced to the market. This paper describes the chemical structure and physical .. read more

Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the soldering steps significantly impair the cross linkage and can be sa .. read more

As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must be considered. One process that is often over looked is the cleaning of .. read more

The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste formulations and their process conditions as manufacturers move to Lea .. read more

Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to the well known EPA Method 1311 leaching protocol. Based on work from th .. read more

Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a .. read more

Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide electronics industry. This paper reviews the status of Lead Free solde .. read more

Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS legislation is a reality. Even those market segments with exemptions mean .. read more

Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints defined by engineering and create a layout that adheres to those design .. read more

During the design phase of a project,distribution of metal on the external layers of printed circuit boards is not a consideration. System designers concentrate on implementing the required log .. read more

Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a number of challenges in both the surface mount and wave soldering proce .. read more

Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture .. read more

The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer temperatures; faster clock cycles and higher bandwidths; higher component density .. read more

Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal of lead from electronics brings massive changes for all companies in th .. read more

Vacuum-condensation soldering is a new process,developed to combine the advantages of condensation soldering and vacuum soldering. The lecture introduces the results of the project development, .. read more

One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste formulation,reflow profile and board finish,when selected carefully, .. read more

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are considerably longer than those used for lead-bearing products. This is due to .. read more

One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead- .. read more

Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version,both having 560 I/Os,were prese .. read more

Legitimate concern exists regarding sending spacecraft and their associated hardware to solar system bodies where they could possibly contaminate the body’s surface with terrestrial microorgani .. read more

Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to inspect printed solder paste deposits immediately after the printin .. read more

With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture. With BGA components sometimes costing hundreds or even thousands of US .. read more

This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place system for the purpose of both defect detection and process-control a .. read more

Carbon Composite raw material property comparison are summarized below: -Thermal Conductivity – Watts per meter ? Kelvin. The core material can spread up to 620.0 W/m?K. -CTE – parts per millio .. read more

Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data transmission speed. Therefore,we have developed a new profi .. read more

At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming smaller in size and packed more densely on circuit boards. Together these .. read more

The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are scheduled to ban Pb alloys in July 2006. China is in process of preparin .. read more

European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These regulations have a great impact on the Electronic Packaging and Interconnect .. read more