Global Electronics Association Knowledge Hub

For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and RoHS. In most cases,it has been theoretical and few companies in Scandinavia h .. read more

Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J .. read more

The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due to environmental issues and new regulations concerning lead,such a .. read more

A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention Lead free Solder project. The purpose of the project was to validate and .. read more

Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component densities on the printed circuit board. As a result,assembly equipmen .. read more

Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste form .. read more

Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost. Surface mount technology still prevails in low cost electronics (telev .. read more

Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field effect transistors (OFETs) with micron-sized features. This has led to a wide- .. read more

Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film resistive material for embedded resistors. Until now the utilizatio .. read more

Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the Sanmina Corporation is a familiar example. Conceptually,this product consists of .. read more

The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller dimensions for everything. A question that arises frequently in this .. read more

Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi .. read more

A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability of Types III,IV and V solder paste in terms of opens,shorts,solder s .. read more

Many words have been written about the impending lead free transition,during this period of frantic discovery lots has been communicated about the reflow and alloy concerns; But the print proce .. read more

Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of electronic components. The High Density Package Users Group,HDPUG,Consortium .. read more

The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe .. read more

Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to support lead-free assembly. The High Density Packaging User’s Group has co .. read more

Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP .. read more

The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of Pollution Prevention / Joint Council of Aging Aircraft (JG-PP / JCAA) Lead F .. read more

A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed. The copper substrate is plated with a silver layer as stress buffer. We bon .. read more

The kinetics of activator disappearance were investigated for a wave-soldering flux containing two activators,succinic and glutaric acids. Three loadings of flux were applied to bare FR4 panels .. read more

Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as cabling harness technology,IC packaging and as replacement for rigid board .. read more

Flexible circuit interconnects for ultrasound transducer applications are among the most difficult to fabricate and make good representative circuits for medical applications. The polyimide die .. read more

For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth, solidified at controlled cooling rates. The microstructure of the various B .. read more

The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S .. read more

Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the introduction of lead free solders has created additional difficulties. .. read more

No two printed circuit boards look exactly alike. Even across two adjacent boards on an assembly line,one can find significant differences arising out of normal process variation – the componen .. read more

By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic) Solder process to a Lead Free process. The implementation of this change re .. read more

A process called computational reliability modeling is described herein as well as how the reliability predictions from this modeling approach match experimental data (both lead and lead-free s .. read more

A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is defined as one or more connections that show physical contact but no wetting .. read more

Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases produced during flux volatilization during SMT,air entrapment in plated t .. read more

High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end user requirements for high-speed signal transmission and lead-free solder .. read more

When manufacturing printed wiring boards and assemblies it is often necessary to cover certain areas prior to soldering operations in order to avoid them being wetted with solder. Such areas ma .. read more

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents the production experience in typical horizontal lines to demonstrate .. read more

The advent of surface mount technology and now the lead free issue have ushered in a new wave of solderability treatments, in particular the flat hard metal finishes. Among others these include .. read more

In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al .. read more

Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability requirement for these products. With the switch to lead free solder .. read more

The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This paper presents the results from the first phase of a two-part study t .. read more

In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the elimination of lead (Pb) from packages. During the transitional period,both .. read more

In these days of high mix low volume there is increasing pressure on the SMT departments of manufacturing companies to reduce changeover times and increase machinery utilization. An enormous ef .. read more

Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The most common choices to find manufacturing defects on printed circuit b .. read more

Volume electronic manufacturing environments are constantly seeking solutions to bottlenecks at end-of-line test. Bottlenecks are being seen increasingly on high volume automotive,telecomm & co .. read more

Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have been developed to perform thermal cycling testing and in particular,to m .. read more

The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me .. read more

Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure plated through hole via reliability. Both of these test methods have prove .. read more

Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following assembly operations. Damage to the PWB preferentially followed the warp dire .. read more

Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring boards due to expected enhancements in strength and achievable wiring .. read more

This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper builds on earlier work by correlating plating cell and tank design issue .. read more

With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and pitches designers are faced with the dilemma on how design their products in t .. read more