Global Electronics Association Knowledge Hub

The constant drive by designers to create more functionally unique products has challenged the assembly community for some time. As a result,many processes have been developed under the “Necess .. read more

Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that does not contain lead. This is of course is not straight forward as it .. read more

Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend on the physical properties of the solder and the laminate material used. A .. read more

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting,the microstructure (in particular t .. read more

The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic by industry test engineers,due to contact failures associated with t .. read more

Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining whether the materials of construction for printed wiring assemblies (PWAs) are .. read more

Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics .. read more

Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a .. read more

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each generation,companies are offering more and more features and/or capability. .. read more

Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed circuit boards,but this may change with increasing technical,economic and re .. read more

The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for applications ranging from smart cards to space-based radars. For hig .. read more

Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is the question of hermeticity. Plastic materials generally allow mois .. read more

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace application .. read more

Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament,a copper salt,grows from a .. read more

The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion USD production value in 2003. The association of the industry,CPCA,als .. read more

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Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance. .. read more

As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and E .. read more

The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of reg .. read more

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In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of th .. read more

Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical .. read more

As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing .. read more

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The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In .. read more

Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high .. read more

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Last spring at EXPO,embedded passives came into its own by being escalated from a sub-committee with 4 task groups to a general committee with 4 sub-committees. Dave McGregor of Dupont now chai .. read more

Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit .. read more

This work initially started with some research into ink jet technology materials for legend printing. Our company in Hong Kong was working at the time with a Japanese company with the end goal .. read more

This paper is the second concerning the use of existing electrical test equipment being programmed to first measure the values of plated additive resistors manufactured on circuit board inner l .. read more

The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a .. read more

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Over the past six years Motorola has shipped over 47 million phones incorporating Embedded Passives (EP) technology. The EP modules shipped in phones have included small modules such as voltage .. read more

Embedded passive components are resistors,capacitors and inductors buried within a multilayer PCB. Embedded components pass standard reliability test methods,however,the higher temperatures req .. read more

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Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa .. read more

This paper presents the qualification of a new,very thin,printed circuit board (“PCB”) dielectric substrate (“core”) to meet Teradyne’s performance and reliability design goals for a power supp .. read more

While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe .. read more

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The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini .. read more

The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ .. read more

When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact signal integrity at high data rates including: inconsistencies in dielectri .. read more

The dramatic economic downturn of the PWB industry starting in the forth quarter of 2000,which resulted in a reduction of 1/3 of the demand and corresponding supply chain within one year,has ch .. read more

The number of PCB manufacturers in Europe declined from 700 in the nineties to 400 early this decade and is forecasted to shrink to the range of 100 by 2010. A share of these companies will not .. read more

In order to cope with a rapid increase in information processing speed,additional technical developments of an optical-electrical composite board are required. Generally speaking,it is more dif .. read more

The concept revealed is a simple architecture for an optical printed circuit board,which permits manufacturing with the materials normally used in printed circuit board fabrication. This concep .. read more

This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal Performance Project team. The project focused on the development of a cle .. read more