Global Electronics Association Knowledge Hub

Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus whisker growth can be regarded as a grain growth phenomenon. In this paper we examine .. read more

The OEM desires identified in the 2002 – 2003 roadmap clearly identify,through their emulators,the present and future needs of the products that the emulators represent. There are a total of ei .. read more

We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEI .. read more

High speed systems operating at speeds of 2GHz and above are placing increasing demands on the specifications of substrates and packaging of components used within these systems. BPA has review .. read more

National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key issues identified by the industry. These cover the areas of Fiber Management,Sig .. read more

Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC package terminals in terms of solder wetting ability. Current industrial .. read more

The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is key to proper solder joint formation. Robust solder paste performance is needed .. read more

The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process. The presence of solder flux residues,solder mask,underfill or any SMT material .. read more

Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and cabin management systems for the Boeing family of commercial airplanes. Boeing speci .. read more

As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a more attractive technology option over the incumbent thermal and moisture curing .. read more

Conformal or protective coatings are widely used in the electronics industry today and are available in a large variety of different types and adjustments. The "classic" or conventional conform .. read more

Over the years,electronic components have become increasingly smaller and integrated. Spacing between components and line to line spacing has continually shrunk. This miniaturization has magnif .. read more

The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the commercially available tin-silver-copper alloys and their processing and reliabilit .. read more

With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to minimize the pollution on the environment. The use of the lead free solder is repl .. read more

Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics when fresh but then suffer rapid degradation. Although rosin based pastes .. read more

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more

Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating of these alloys is challenging because of great difference in reduction pote .. read more

The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is one of the alternatives and may be the simplest system as a “drop-in” replac .. read more

Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks to the Wave Soldering process is the high cost associated with maintaining and o .. read more

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s Wave Solder systems. Users are experiencing higher maintenance frequency and re .. read more

Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical connection. Solder paste is generally deposited using a mass imaging process,suc .. read more

The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes requ .. read more

Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn. Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p .. read more

The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based corporations to investigate lead-free (Pb-free) surface mount soldering technology. The .. read more

With the Waste Electrical and Electronic Equipment (WEEE) Directive in Europe outlawing lead from many electronic devices produced and imported in the EU by July 2006,as well as with foreign co .. read more

The full hermetic package for electronics and optoelectronic (OE) devices was first developed in the 1800’s and has served these industries well. The earliest optoelectronic devices,cathode ray .. read more

A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board (PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) techno .. read more

One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging needs for MicroSystems and MEMS technology vary by structure and application. Major i .. read more

Sandia National Laboratories has programs covering the range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad .. read more

Electronic devices become more and more smaller. Electronic assemblies are sensitive against electrostatic discharge just as much as its smallest and most sensitive element. So protection syste .. read more

The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and construct optoelectronic packages,sub-assemblies,and other electronic materials is b .. read more

The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over extended distances in the optical domain,without the need for power-hungry and ba .. read more

Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE) in flip chip technology. An extension of this application has been used to increase the .. read more

Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics manufacturing industry. As the solder joint size decreases,it has become apparent that unde .. read more

A technique that enhances the release of solder paste from stencils during the print process has been developed. The technique is based on applying variable high frequency and low amplitude vib .. read more

The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller, efficient electronic packages. In recent years wafer level packaging concepts ha .. read more

Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder paste printing applications are approaching that of typical bumping technologie .. read more

In the complex electronics industry,supply chain costs can have a major impact on a company’s profitability. Like the industrial supply chain,where costs are estimated to account for as much as .. read more

Today’s SMT assemblies are being driven toward SMD’s with higher lead densities as well as smaller packages. This places additional performance requirements on the printing process. The stencil .. read more

Quantitative solder paste performance or use testing enables material formulators to focus on and maximize key material traits such as wettability and printability. These same material test met .. read more

The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area array packages instead of fine pitch leaded packages. These area array packages .. read more

Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is even more crucial in today’s packaging,due to the high ratio of passive components .. read more

The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven electronic components to smaller and smaller sizes. This decease in size does .. read more

In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to significantly improve process control and documentation. Manufacturers have acceler .. read more

Boundary-scan has achieved many of the goals envisioned by its original architects and today is in use in thousands of production facilities around the world to test complex digital printed cir .. read more

This paper will discuss: a. Boundary scan as a key test tool that enables the leveraged test approach b. The advantages of standardizing and reusing design verification tests and PLD programs i .. read more

The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous challenges during assembly. This is especially true in an Electronics Manufacturing Ser .. read more

For high reliability applications,the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced .. read more

The electronics content of many consumer products has increased substantially over the past decade. Several of the electronics added to the automobile control vehicle functions that have a dire .. read more

Manufacturers can use DPMO metrics to reduce the cost of PCB assembly with fewer resources. DPMO data can be used for predicting the fault spectrum on future products,quoting new business,setti .. read more