Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. weiterlesen
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. weiterlesen
Conformable, Light-Weight Power Harvesting Textiles
Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including
.. weiterlesen
Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles
Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove
.. weiterlesen
Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)
SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics. These stretchable electronics are applicable to wearable
.. weiterlesen
Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking
Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem. Current fabric-based to
.. weiterlesen
Smart Fabrics For Physiological Status Monitoring
The research presented in this slide show utilizes E-Textiles.
The applications include:
Physiological Status Monitoring
Cognitive Status Monitor
.. weiterlesen
The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research
The DoD conducted a survey of PCB companies and the effects of COVID19. The survey results showed that:
Some U.S PrCB manufacturing facilities were significantly impa
.. weiterlesen
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. weiterlesen
DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base
The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i
.. weiterlesen
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. weiterlesen
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. weiterlesen
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. weiterlesen
Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond
The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs,
.. weiterlesen
The IPC-2551 Digital Twin Standard
One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac
.. weiterlesen
Conformal Coating Evaluation Test Development
The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co
.. weiterlesen
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. weiterlesen
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. weiterlesen
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. weiterlesen
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. weiterlesen
Powering The Internet of Things
This Slide Show Utilizes the Cover Paper from the session.
This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts
.. weiterlesen
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This slide show discusses inverters and power electronics for Heavy Machinery. There is discussion of Wide Band Gap Powered Devices. The purpose is increased efficiency gains.&nb
.. weiterlesen
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics
All electronics products need a power source
.. weiterlesen
Packaging and Manufacturability Considerations for Strategic Power Applications
All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications
.. weiterlesen
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. weiterlesen
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. weiterlesen
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. weiterlesen
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. weiterlesen
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. weiterlesen
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. weiterlesen
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. weiterlesen
Conformable, Light-Weight Power Harvesting Textiles
Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including
.. weiterlesen
Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles
Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove
.. weiterlesen
Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)
SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics. These stretchable electronics are applicable to wearable
.. weiterlesen
Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking
Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem. Current fabric-based to
.. weiterlesen
Smart Fabrics For Physiological Status Monitoring
The research presented in this slide show utilizes E-Textiles.
The applications include:
Physiological Status Monitoring
Cognitive Status Monitor
.. weiterlesen
The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research
The DoD conducted a survey of PCB companies and the effects of COVID19. The survey results showed that:
Some U.S PrCB manufacturing facilities were significantly impa
.. weiterlesen
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. weiterlesen
DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base
The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i
.. weiterlesen
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. weiterlesen
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. weiterlesen
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. weiterlesen
Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond
The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs,
.. weiterlesen
The IPC-2551 Digital Twin Standard
One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac
.. weiterlesen
Conformal Coating Evaluation Test Development
The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co
.. weiterlesen
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. weiterlesen
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. weiterlesen
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. weiterlesen
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. weiterlesen
Powering The Internet of Things
This Slide Show Utilizes the Cover Paper from the session.
This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts
.. weiterlesen
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This slide show discusses inverters and power electronics for Heavy Machinery. There is discussion of Wide Band Gap Powered Devices. The purpose is increased efficiency gains.&nb
.. weiterlesen
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics
All electronics products need a power source
.. weiterlesen
Packaging and Manufacturability Considerations for Strategic Power Applications
All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications
.. weiterlesen
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. weiterlesen
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. weiterlesen
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. weiterlesen
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. weiterlesen
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. weiterlesen