Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
.. weiterlesen
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
.. weiterlesen
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. weiterlesen
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
.. weiterlesen
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. weiterlesen
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
.. weiterlesen
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. weiterlesen
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. weiterlesen
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. weiterlesen
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. weiterlesen
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. weiterlesen
"0201 Parts (0.25 Mm X 0.125 Mm,008004") "Arrived on the Scene in Order to Make the Technology for Future Device...
To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m
.. weiterlesen
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. weiterlesen
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. weiterlesen
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti
.. weiterlesen
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. weiterlesen
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. weiterlesen
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha
.. weiterlesen
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. weiterlesen
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High...
In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable.
.. weiterlesen
Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th
.. weiterlesen
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa
.. weiterlesen
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. weiterlesen
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. weiterlesen
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. weiterlesen
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. weiterlesen
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. weiterlesen
High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process
Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu
.. weiterlesen
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. weiterlesen
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. weiterlesen
Screen Making for Printed Electronics - Specification and Tolerancing
Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known
.. weiterlesen
Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates
Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve
.. weiterlesen
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. weiterlesen
Flowers of Sulfur Creep Corrosion Testing of Populated Printed Circuit Boards
Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch
.. weiterlesen
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. weiterlesen
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may
.. weiterlesen
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. weiterlesen
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. weiterlesen
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. weiterlesen
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. weiterlesen
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. weiterlesen
"0201 Parts (0.25 Mm X 0.125 Mm,008004") "Arrived on the Scene in Order to Make the Technology for Future Device...
To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m
.. weiterlesen
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. weiterlesen
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. weiterlesen
Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti
.. weiterlesen
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. weiterlesen
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. weiterlesen
Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha
.. weiterlesen
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. weiterlesen
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste Formulated with Rosin and Anti-Crack Resin for Automotive and Other High...
In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable.
.. weiterlesen
Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th
.. weiterlesen
Counterfeit Electronic Components Identification: A Case Study
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa
.. weiterlesen
Fill the Void II: An Investigation into Methods of Reducing Voiding
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu
.. weiterlesen
Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations
.. weiterlesen
3D Printed Electronics for Printed Circuit Structures
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o
.. weiterlesen
Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el
.. weiterlesen
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app
.. weiterlesen
High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process
Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu
.. weiterlesen
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. weiterlesen
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. weiterlesen