Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. weiterlesen
Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t
.. weiterlesen
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ
.. weiterlesen
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of
.. weiterlesen
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. weiterlesen
Surface Mount Signed Warpage Case Study
Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin
.. weiterlesen
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. weiterlesen
Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding
.. weiterlesen
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. weiterlesen
An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so
.. weiterlesen
Rework Challenges for Leading Edge Components BGA,QFN,and LED in Today's Fast Moving Industry
The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density
.. weiterlesen
AOI Capabilities Study with 03015 Component
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci
.. weiterlesen
Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor
Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d
.. weiterlesen
High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc
.. weiterlesen
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. weiterlesen
The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ
.. weiterlesen
Use of High Purity Water to Eliminate Contamination and Achieve Cleanliness - A Discussion of Performance and Costs
PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio
.. weiterlesen
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. weiterlesen
Does Cleaning the PCB Before Conformal Coating Add Value
Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of
.. weiterlesen
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints
With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific
.. weiterlesen
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide
.. weiterlesen
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. weiterlesen
Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. weiterlesen
Database Driven Multi Media Work Instructions
Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with
.. weiterlesen
Embracing a New Paradigm: Electronic Work Instructions (EWI)
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation a
.. weiterlesen
Soldering Immersion Tin
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r
.. weiterlesen
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free
.. weiterlesen
Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
.. weiterlesen
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. weiterlesen
The EMS Gateway Model - Local to Global,Seamlessly
Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in v
.. weiterlesen
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. weiterlesen
Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t
.. weiterlesen
Process Control of Ionic Contamination Achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ
.. weiterlesen
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of
.. weiterlesen
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. weiterlesen
Surface Mount Signed Warpage Case Study
Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin
.. weiterlesen
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. weiterlesen
Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles
The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding
.. weiterlesen
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. weiterlesen
An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so
.. weiterlesen
Rework Challenges for Leading Edge Components BGA,QFN,and LED in Today's Fast Moving Industry
The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density
.. weiterlesen
AOI Capabilities Study with 03015 Component
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci
.. weiterlesen
Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor
Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d
.. weiterlesen
High Frequency Dk and Df Test Methods Comparison,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc
.. weiterlesen
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. weiterlesen
The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ
.. weiterlesen
Use of High Purity Water to Eliminate Contamination and Achieve Cleanliness - A Discussion of Performance and Costs
PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio
.. weiterlesen
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. weiterlesen
Does Cleaning the PCB Before Conformal Coating Add Value
Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of
.. weiterlesen
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints
With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific
.. weiterlesen
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide
.. weiterlesen
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. weiterlesen
Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. weiterlesen
Database Driven Multi Media Work Instructions
Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with
.. weiterlesen
Embracing a New Paradigm: Electronic Work Instructions (EWI)
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation a
.. weiterlesen
Soldering Immersion Tin
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r
.. weiterlesen
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free
.. weiterlesen
Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
.. weiterlesen
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. weiterlesen
The EMS Gateway Model - Local to Global,Seamlessly
Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in v
.. weiterlesen