Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Und
.. weiterlesen
Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. weiterlesen
Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPGBA Packages and Assemblies
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a
.. weiterlesen
AXI Voiding Detection on High Power Transistor
High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation
.. weiterlesen
Elimination of Wave Soldering Process
Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde
.. weiterlesen
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. weiterlesen
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. weiterlesen
Thermo-Electric Cooler Module Reliability Improvements for CT Detector Subsystem
Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp
.. weiterlesen
A Structured Approach for Failure Analysis and Root Cause Determination for a Complex System Involving Printed Wiring Assemblies
Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri
.. weiterlesen
Round Robin of High Frequency Test Methods by IPC-D24C Task Group
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l
.. weiterlesen
High Frequency RF Electrical Performance Effects of Plated through Hole Vias
Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some
.. weiterlesen
An Interesting Approach to Yield Improvement for the Solder Paste Printing and Reflow Process
Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t
.. weiterlesen
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. weiterlesen
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. weiterlesen
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. weiterlesen
Combining Six Sigma Tools with Lean Performance Measurement to Sustain Continuous Improvement Activities
Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from cre
.. weiterlesen
Lean Six Sigma Approach to New Product Development
In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little (ADL) [1] re
.. weiterlesen
Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards
The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i
.. weiterlesen
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. weiterlesen
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. weiterlesen
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. weiterlesen
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. weiterlesen
Smart Factory at Fuyong
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact
.. weiterlesen
Will the "Internet of Manufacturing" Really Affect Business?
With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au
.. weiterlesen
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of
.. weiterlesen
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. weiterlesen
Low Profile Embedded Magnetics for RF Communication Systems
Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo
.. weiterlesen
NSOP Reduction for QFN RFIC Packages
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages
.. weiterlesen
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. weiterlesen
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Aperture Area Ratios
Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp
.. weiterlesen
Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Und
.. weiterlesen
Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. weiterlesen
Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPGBA Packages and Assemblies
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a
.. weiterlesen
AXI Voiding Detection on High Power Transistor
High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation
.. weiterlesen
Elimination of Wave Soldering Process
Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde
.. weiterlesen
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. weiterlesen
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. weiterlesen
Thermo-Electric Cooler Module Reliability Improvements for CT Detector Subsystem
Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp
.. weiterlesen
A Structured Approach for Failure Analysis and Root Cause Determination for a Complex System Involving Printed Wiring Assemblies
Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri
.. weiterlesen
Round Robin of High Frequency Test Methods by IPC-D24C Task Group
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l
.. weiterlesen
High Frequency RF Electrical Performance Effects of Plated through Hole Vias
Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some
.. weiterlesen
An Interesting Approach to Yield Improvement for the Solder Paste Printing and Reflow Process
Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t
.. weiterlesen
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. weiterlesen
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. weiterlesen
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. weiterlesen
Combining Six Sigma Tools with Lean Performance Measurement to Sustain Continuous Improvement Activities
Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from cre
.. weiterlesen
Lean Six Sigma Approach to New Product Development
In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little (ADL) [1] re
.. weiterlesen
Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards
The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i
.. weiterlesen
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. weiterlesen
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. weiterlesen
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. weiterlesen
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. weiterlesen
Smart Factory at Fuyong
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact
.. weiterlesen
Will the "Internet of Manufacturing" Really Affect Business?
With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au
.. weiterlesen
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of
.. weiterlesen
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. weiterlesen
Low Profile Embedded Magnetics for RF Communication Systems
Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo
.. weiterlesen
NSOP Reduction for QFN RFIC Packages
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages
.. weiterlesen
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. weiterlesen
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Aperture Area Ratios
Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp
.. weiterlesen