Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A New Line Balancing Method Considering Robot Count and Operational Costs in Electronics Assembly
Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems,which need frequent readjustments as models
.. weiterlesen
BTC and SMT Rework Challenges
Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required
.. weiterlesen
Hand Printing using Nanocoated and other High End Stencil Materials
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a “one and done” ass
.. weiterlesen
Rework of New High Speed Press Fit Connectors
More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm
.. weiterlesen
Connecting to Embedded Components Using TLPS (Transient Liquid Phase Sintering) Pastes in Via Layers
The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the ex
.. weiterlesen
Electronic Packaging and Interconnect Tool Box for Secured Smart Systems Packaging
Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro
.. weiterlesen
Hybrid ALD/CVD as a Low-Cost Alternative Protective Coating to Poly-Para-Xylylene and Traditional Liquid Conformal Coatings
A new hybrid ALD/CVD protective coating is being considered as a low-cost alternative to poly-para-xylylene and traditional liquid conformal coatings. All of the typical conformal coatings prot
.. weiterlesen
UV Broad Spectrum & LED Curable 100% Solids Very Low Viscosity Conformal Coating
Very low viscosity formulations are often required for very thin conformal coating applications. Solvents are used to reduce viscosity of the formulations and accommodate dispensing needs. Solv
.. weiterlesen
Moisture Diffusion Modeling of a Thin Film Acrylic Resin Based Conformal Coating on PCBA
High reliability process automation devices require serious protection from harsh environments which can be a combination of moisture,corrosive gases and liquids,salt sprays,large temperature v
.. weiterlesen
Investigation of Characteristics of Lead-Free Powders for Solder Paste Application
Solder paste has been used in the surface mount technology for many years. However,a complete understanding of the effect of key powder characteristics on the paste properties is still not achi
.. weiterlesen
Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder p
.. weiterlesen
Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. weiterlesen
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi
.. weiterlesen
Reduce Pollution of Process Gasses in an Air Reflow Oven
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin sys
.. weiterlesen
Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads
IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t
.. weiterlesen
Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. weiterlesen
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. weiterlesen
Digital PCB Production Using Industrial Inkjet Printing
From photo film to digital camera,from letters to emails,from books to e-readers,from vinyl to MP3: the whole world is turning digital. Yet,ironically,the core compound driving the digitization
.. weiterlesen
Utilization of Inkjet Technology for Primary Imaging of Printed Circuit Boards
The rules of the game in PCB production are changing with new disruptive technologies. At the company there has been the implementation of a “primary image inkjet-resist” printer for both inner
.. weiterlesen
Evaluation of Stretchable Conductive Ink
With increasing popularity and momentum for wearable and printed electronics,stretchable printed ink has become a hot subject for study and application. Circuitry printed from stretchable ink r
.. weiterlesen
Best Practices for RoHS Compliance in Support of CE Marking
In 2012,The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to b
.. weiterlesen
Best Practices for Enterprise Supply Chain Data Collection
One of the biggest challenges a corporate environmental compliance team faces is to collect complete and accurate material and substance data in a timely manner from suppliers. This paper will
.. weiterlesen
Successful Material Compliance Reporting Strategies for the Electronic Industry
Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and fro
.. weiterlesen
Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD). Multiple Reball Trial and...
Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres
.. weiterlesen
Advanced Rework Applications in a Shrinking World
As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push t
.. weiterlesen
Water Soluble Solder Paste,Wet Behind the Ears or Wave of the Future?
Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi
.. weiterlesen
Paste Jetting Within a Solder Paste Inspection Process
In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand
.. weiterlesen
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance
From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou
.. weiterlesen
Development of a Consistent and Reliable Thermal Conductivity Measurement Method,Adapted to Typical Composite Materials Used in the PCB Industry
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo
.. weiterlesen
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. weiterlesen
A New Line Balancing Method Considering Robot Count and Operational Costs in Electronics Assembly
Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems,which need frequent readjustments as models
.. weiterlesen
BTC and SMT Rework Challenges
Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required
.. weiterlesen
Hand Printing using Nanocoated and other High End Stencil Materials
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a “one and done” ass
.. weiterlesen
Rework of New High Speed Press Fit Connectors
More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm
.. weiterlesen
Connecting to Embedded Components Using TLPS (Transient Liquid Phase Sintering) Pastes in Via Layers
The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the ex
.. weiterlesen
Electronic Packaging and Interconnect Tool Box for Secured Smart Systems Packaging
Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro
.. weiterlesen
Hybrid ALD/CVD as a Low-Cost Alternative Protective Coating to Poly-Para-Xylylene and Traditional Liquid Conformal Coatings
A new hybrid ALD/CVD protective coating is being considered as a low-cost alternative to poly-para-xylylene and traditional liquid conformal coatings. All of the typical conformal coatings prot
.. weiterlesen
UV Broad Spectrum & LED Curable 100% Solids Very Low Viscosity Conformal Coating
Very low viscosity formulations are often required for very thin conformal coating applications. Solvents are used to reduce viscosity of the formulations and accommodate dispensing needs. Solv
.. weiterlesen
Moisture Diffusion Modeling of a Thin Film Acrylic Resin Based Conformal Coating on PCBA
High reliability process automation devices require serious protection from harsh environments which can be a combination of moisture,corrosive gases and liquids,salt sprays,large temperature v
.. weiterlesen
Investigation of Characteristics of Lead-Free Powders for Solder Paste Application
Solder paste has been used in the surface mount technology for many years. However,a complete understanding of the effect of key powder characteristics on the paste properties is still not achi
.. weiterlesen
Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder p
.. weiterlesen
Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. weiterlesen
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi
.. weiterlesen
Reduce Pollution of Process Gasses in an Air Reflow Oven
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin sys
.. weiterlesen
Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads
IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t
.. weiterlesen
Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. weiterlesen
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. weiterlesen
Digital PCB Production Using Industrial Inkjet Printing
From photo film to digital camera,from letters to emails,from books to e-readers,from vinyl to MP3: the whole world is turning digital. Yet,ironically,the core compound driving the digitization
.. weiterlesen
Utilization of Inkjet Technology for Primary Imaging of Printed Circuit Boards
The rules of the game in PCB production are changing with new disruptive technologies. At the company there has been the implementation of a “primary image inkjet-resist” printer for both inner
.. weiterlesen
Evaluation of Stretchable Conductive Ink
With increasing popularity and momentum for wearable and printed electronics,stretchable printed ink has become a hot subject for study and application. Circuitry printed from stretchable ink r
.. weiterlesen
Best Practices for RoHS Compliance in Support of CE Marking
In 2012,The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to b
.. weiterlesen
Best Practices for Enterprise Supply Chain Data Collection
One of the biggest challenges a corporate environmental compliance team faces is to collect complete and accurate material and substance data in a timely manner from suppliers. This paper will
.. weiterlesen
Successful Material Compliance Reporting Strategies for the Electronic Industry
Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and fro
.. weiterlesen
Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD). Multiple Reball Trial and...
Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres
.. weiterlesen
Advanced Rework Applications in a Shrinking World
As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push t
.. weiterlesen
Water Soluble Solder Paste,Wet Behind the Ears or Wave of the Future?
Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi
.. weiterlesen
Paste Jetting Within a Solder Paste Inspection Process
In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand
.. weiterlesen
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance
From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou
.. weiterlesen
Development of a Consistent and Reliable Thermal Conductivity Measurement Method,Adapted to Typical Composite Materials Used in the PCB Industry
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo
.. weiterlesen
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. weiterlesen