Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value...
The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have
.. weiterlesen
Important Considerations in the Design of Solderless Electronic Assemblies
Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control
.. weiterlesen
Press Fit Technology Roadmap and Control Parameters for a High Performance Process
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl
.. weiterlesen
EMI-Caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys
.. weiterlesen
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. weiterlesen
Effective Methods to Get Volatile Compounds Out of Reflow Process
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem
.. weiterlesen
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. weiterlesen
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball
.. weiterlesen
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. weiterlesen
Circuit Technology Crossovers Where PCBs and Printed Electronics Meet
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in
.. weiterlesen
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. weiterlesen
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. weiterlesen
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. weiterlesen
pH Neutral Cleaning Agents - Market Expectation & Field Performance
With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte
.. weiterlesen
Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur
.. weiterlesen
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. weiterlesen
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. weiterlesen
CVS Control of a Via Fill Acid Copper Electroplating Baths
Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape
.. weiterlesen
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. weiterlesen
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. weiterlesen
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. weiterlesen
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. weiterlesen
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. weiterlesen
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. weiterlesen
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. weiterlesen
Selecting Stencil Technologies to Optimize Print Performance
The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can
.. weiterlesen
Enabling High-Speed Printing Using Low Cost Materials: Process Stability is Paramount
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d
.. weiterlesen
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. weiterlesen
Reliability Implications of Pinhole Defects in Soldermask
What are the Raw Material Risks?
-Today PCB Suppliers handle a range of customers with different end use environments
-Telecommunications
-Automotive
-Consumer electronics
-
.. weiterlesen
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. weiterlesen
What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value...
The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have
.. weiterlesen
Important Considerations in the Design of Solderless Electronic Assemblies
Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control
.. weiterlesen
Press Fit Technology Roadmap and Control Parameters for a High Performance Process
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl
.. weiterlesen
EMI-Caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys
.. weiterlesen
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. weiterlesen
Effective Methods to Get Volatile Compounds Out of Reflow Process
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem
.. weiterlesen
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. weiterlesen
Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball
.. weiterlesen
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. weiterlesen
Circuit Technology Crossovers Where PCBs and Printed Electronics Meet
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in
.. weiterlesen
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. weiterlesen
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. weiterlesen
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. weiterlesen
pH Neutral Cleaning Agents - Market Expectation & Field Performance
With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte
.. weiterlesen
Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur
.. weiterlesen
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. weiterlesen
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. weiterlesen
CVS Control of a Via Fill Acid Copper Electroplating Baths
Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape
.. weiterlesen
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. weiterlesen
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. weiterlesen
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. weiterlesen
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. weiterlesen
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. weiterlesen
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. weiterlesen
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. weiterlesen
Selecting Stencil Technologies to Optimize Print Performance
The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can
.. weiterlesen
Enabling High-Speed Printing Using Low Cost Materials: Process Stability is Paramount
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d
.. weiterlesen
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. weiterlesen
Reliability Implications of Pinhole Defects in Soldermask
What are the Raw Material Risks?
-Today PCB Suppliers handle a range of customers with different end use environments
-Telecommunications
-Automotive
-Consumer electronics
-
.. weiterlesen
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. weiterlesen